Study on the Failure Mechanism of a Chip Resistor Solder Joint During Thermal Cycling for Prognostics and Health Monitoring

고장예지를 위한 온도사이클시험에서 칩저항 실장솔더의 고장메커니즘 연구

  • Han, Chang-Woon (Reliability Physics Research Center, Korea Electronics Technology Institute) ;
  • Park, Noh-Chang (Reliability Physics Research Center, Korea Electronics Technology Institute) ;
  • Hong, Won-Sik (Reliability Physics Research Center, Korea Electronics Technology Institute)
  • 한창운 (전자부품연구원 신뢰성물리연구센터) ;
  • 박노창 (전자부품연구원 신뢰성물리연구센터) ;
  • 홍원식 (전자부품연구원 신뢰성물리연구센터)
  • Received : 2011.02.10
  • Accepted : 2011.04.20
  • Published : 2011.07.01


A thermal cycling test was conducted on a chip resistor solder joint with real-time failure monitoring. In order to study the failure mechanism of the chip resistor solder joint during the test, the resistance between both ends of the resistor was monitored until the occurrence of failure. It was observed that the monitored resistance first fluctuated linearly according to the temperature change. The initial variation in the resistance occurred at the time during the cycle when there was a decrease in temperature. A more significant change in the resistance followed after a certain number of cycles, during the time when there was an increase in the temperature. In order to explain the failure patterns of the solder joint, a mechanism for the solder failure was suggested, and its validity was proved through FE simulations. Based on the explained failure mechanism, it was shown that prognostics for the solder failure can be implemented by monitoring the resistance change in a thermal cycle condition.


Failure Mechanism;Prognostics;Solder;Chip Resistor;Thermal Cycling Test


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