Evaluation of Fracture Toughness of Copper Thin Films by Combining Numerical Analyses and Experimental Tests

해석과 실험을 결합한 구리 박막의 파괴인성 평가

  • Kim, Hyun-Gyu (Dept. of Mechanical and Automotive Engineering, Seoul National University of Science & Technology) ;
  • Oh, Se-Young (Dept. of Mechanical and Automotive Engineering, Seoul National University of Science & Technology) ;
  • Kim, Kwang-Soo (Dept. of Mechanical and Automotive Engineering, Seoul National University of Science & Technology) ;
  • Lee, Haeng-Soo (Mechanical Engineering, Ulsan College) ;
  • Kim, Seong-Woong (Korea Institute of Materials Science (KIMS)) ;
  • Kim, Jae-Hyun (Korea Institute of Machinery & Materials (KIMM))
  • 김현규 (서울과학기술대학교 기계자동차공학과) ;
  • 오세영 (서울과학기술대학교 기계자동차공학과) ;
  • 김광수 (서울과학기술대학교 기계자동차공학과) ;
  • 이행수 (울산과학대학교 디지털기계학부) ;
  • 김성웅 (재료연구소) ;
  • 김재현 (한국기계연구원)
  • Received : 2012.07.26
  • Accepted : 2012.09.19
  • Published : 2013.02.04


In this paper, a method of combining numerical analyses and experimental tests is used to evaluate fracture toughness of copper thin films of $15{\mu}m$ thickness. Far-field loadings of a global-local finite element model are inversely estimated by matching crack opening profiles in experiments with numerical results. The fracture toughness is then evaluated using the J-integral for cracks in thin films under far-field loadings. In experiments, Cu thin films attached to Aluminum sheets are loaded indirectly, and crack opening profiles are observed by microscope camera. Stress versus strain curves of Cu thin films are obtained through micro-tensile tests, and the grain size of Cu thin films is observed by TEM analysis. The results show that the fracture toughness of Cu thin films with $500nm{\sim}1{\mu}m$ sized grains is $6,962J/m^2$.


Thin Films;Fracture Toughness;Inverse Problems;Crack Opening Profile;Finite Element Analysis


Supported by : 서울과학기술대학교


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