Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)
- Volume 12 Issue 2
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- Pages.79-84
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- 2013
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- 1738-2270(pISSN)
Prediction of Residual Layer Thickness of Large-area UV Imprinting Process
대면적 UV 임프린팅 공정에서 잔류층 두께 예측
- Kim, Kug Weon (Department of Mechanical Engineering, Soonchunhyang University)
- 김국원 (순천향대학교 공과대학 기계공학과)
- Received : 2013.06.03
- Accepted : 2013.06.17
- Published : 2013.06.30
Abstract
Nanoimprint lithography (NIL) is the next generation photolithography process in which the photoresist is dispensed onto the substrate in its liquid form and then imprinted and cured into a desired pattern instead of using traditional optical system. There have been considerable attentions on NIL due to its potential abilities that enable cost-effective and high-throughput nanofabrication to the display device and semiconductor industry. Although one of the current major research trends of NIL is large-area patterning, the technical difficulties to keep the uniformity of the residual layer become severer as the imprinting area increases more and more. In this paper, with the rolling type imprinting process, a mold, placed upon the
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