Stress Analysis for Bendable Electronic Module Under Thermal-Hygroscopic Complex Loads

열·습도 복합하중에서의 유연성 전자모듈에 대한 구조해석

  • Han, Changwoon (Components & Materials Physics Research Center, Korea Electronics Technology Institute) ;
  • Oh, Chulmin (Components & Materials Physics Research Center, Korea Electronics Technology Institute) ;
  • Hong, Wonsik (Components & Materials Physics Research Center, Korea Electronics Technology Institute)
  • 한창운 (전자부품연구원 부품소재물리연구센터) ;
  • 오철민 (전자부품연구원 부품소재물리연구센터) ;
  • 홍원식 (전자부품연구원 부품소재물리연구센터)
  • Received : 2012.10.04
  • Accepted : 2013.01.31
  • Published : 2013.05.01


A bendable electronic module is developed. In this module, thin silicon electronic chips are embedded in a polymer-based encapsulating adhesive between flexible copper-clad polyimide layers. During the qualification test of a harshly thermal-hygroscopic complex loading condition, delaminations occur inside the module layers. A finite element model is developed for the module. To investigate the effect of hygroscopic stress on delamination, the results of the thermal and thermal-hygroscopic loads are compared. The analysis results reveal that the hygroscopic effect more strongly affects delamination than does the thermal effect. The potential failure mechanisms of the module are investigated based on the stress analysis.


Bendable Electronic Module;Thermal and Hygroscopic Loading;Autoclave Test


Supported by : 지식경제부


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