DOI QR코드

DOI QR Code

구리 박막 제조중 증착 중단시 박막 결정립 크기 변화가 인장응력 방향으로의 응력 이동에 미치는 영향

이세리;오승근;김영만
Lee, Seri;Oh, Seungkeun;Kim, Youngman

  • 투고 : 2014.07.28
  • 심사 : 2014.12.09
  • 발행 : 2014.12.31

초록

In this study, the average in-situ stress in metallic thin film was measured during deposition of the Cu thin films on the Si(111) wafer and then the phenomenon of stress shift by the interruption of deposition was measured using Cu thin films. We have observed the stress shift in accordance with changing amount of atom's movement between the surface and grain boundary through altering the grain size of the Cu thin film with variety of parameters. The grain size is known to be affected on the deposition rate, film thickness and deposition temperature. As a experimental results, the these parameters was not adequate to explain stress shift because these parameters affect directly on the amount of atom's movement between the surface and grain boundary as well as the grain size. Thus, we have observed the stress shift toward tensile side in accordance with the grain size changing through the interlayer deposition. From an experiment with inserting interlayer before deposit Cu, in thin film which has big grain size with high roughness, amount of stress movement is higher along direction of tensile stress after deposition that means, after deposition process, driving force of atoms moving in grain boundary and on the surface of the film is relatively higher than before.

키워드

thin film;in-situ;stress shift;grain size;E-beam Evaporation

참고문헌

  1. M. Laugier, 31 (1981) 155.
  2. R. C. Cammarata, T. M. Trimble, D. J. Srolovitz, J. Mater. Res., 15 (2000) 246.
  3. K. Kinosita, K. Maki, K. Nakamiz, K. Takeuchi, Jpn. J. Appl. Phys., 6 (1967) 42. https://doi.org/10.1143/JJAP.6.42
  4. R. Abermann, Vacuum 41 (1990) 1279. https://doi.org/10.1016/0042-207X(90)93933-A
  5. R. Abermann, R. Koch and R. Kramer, Thin Solid Films, 58 (1979) 365. https://doi.org/10.1016/0040-6090(79)90272-4
  6. R. W. Hoffman, Thin Solid Films, 34 (1976) 185. https://doi.org/10.1016/0040-6090(76)90453-3
  7. E. Chason, B. W. Sheldon, L. B. Freund, J. A. Floro, S. J. Hearne, Phys. Rev. Lett., 88 (2003) 156103.
  8. J. W. Shin, E. Chason, Phys. Rev. Lett., 103 (2009) 056102. https://doi.org/10.1103/PhysRevLett.103.056102
  9. E. Chason, J. W. Shin, J. Hearne and L. B. Freund: J. Appl. Phys., 111 (2012) 083520. https://doi.org/10.1063/1.4704683
  10. C. Herzig and S. V. Divinski: Mater. Trans., 44 (2003) 1427.
  11. G. Neumann, C. Tuijn: Handbook of Experimental Data, Self-Diffusion and Impurity Diffusion in Pure Metals, (Elsevier Ltd., Oxford, UK, 2009).
  12. R. Abermann, R. Kramer, J. Maser, Thin Solid Films, 52 (1978) 215. https://doi.org/10.1016/0040-6090(78)90140-2
  13. A. L. Shull, F. Spaepen, J. Appl. Phys., 80 (1996) 6243. https://doi.org/10.1063/1.363701
  14. R. W. Ballufi, Met. Trans. B., 13 (1982) 527553.
  15. B. Amin-Ahmadi, H. Idrissi, M. Galceran, M.S. Colla, J. P. Raskin, T. Pardoen, S. Godet, D. Schryvers, Thin Solid Films, 539 (2013) 145. https://doi.org/10.1016/j.tsf.2013.05.083
  16. Q. Xiao, H. He, S. Sha, J. Shao, Z. Fan, Thin Solid Films 517 (2009) 4295. https://doi.org/10.1016/j.tsf.2008.11.138
  17. S. Ebrahimiasl, W. M. Z. W. Yunus, A. Kassim, Z. Zainal, Solid State Sciences, 12 (2010) 1323. https://doi.org/10.1016/j.solidstatesciences.2010.04.033
  18. Y. Caoa, S. Allameh, D. Nankivil, S. Sethiaraj, T. Otiti, W. Soboyejo, Materials Science and Engineering: A, 427 (2006) 232. https://doi.org/10.1016/j.msea.2006.04.080
  19. Z. An, H. Ding, Q. Meng, Y. Rong, S. Materialia, 61 (2009) 1012. https://doi.org/10.1016/j.scriptamat.2009.08.014
  20. N. R. Shamsutdinov, A. J. Bo ttger, F. D. Tichelaar, Scripta Materialia 54 (2006) 1727. https://doi.org/10.1016/j.scriptamat.2006.02.008
  21. W. D. Nix, Metall. Trans., A 20 (1989) 2217. https://doi.org/10.1007/BF02666659
  22. J. A. Floro, S. J. Hearne, J. A. Hunter, P. Kotula, E. Chason, S. C. Seel, C. V. Thompson, J. Appl. Phys., 89 (2001) 4886. https://doi.org/10.1063/1.1352563
  23. M. A. Phillips, V. Ramaswamy, B.M. Clemens, and W. D. Nix, J. Mater. Res., 15 (2000) 2540. https://doi.org/10.1557/JMR.2000.0364
  24. B. W. Sheldon, A. Lau, and A. Rajamani, J. Appl. Phys., 90 (2001) 5097. https://doi.org/10.1063/1.1412577
  25. G. Gerald Stoney, Proc. R. Soc. Lond. A 82 (1909)
  26. E. Chason, Thin Solid Films, 526 (2012) 1. https://doi.org/10.1016/j.tsf.2012.11.001
  27. P. Politia, G. Grenete, A. Martyd, A. Ponchetf, Jacques Villainb. Physics Reports. 324 (5)-(6) (2000)
  28. Z. Wu, J. M. Dickey, Thin Solid Films., 371 (2000)