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Development of Hybrid Fused Deposition Modeling System for Three-Dimensional Circuit Device Fabrication

3 차원 회로 장치 제작을 위한 FDM 기반의 통합 시스템 개발

  • O, Sung Taek (Dept. of Precision Mechanical Engineering, Chungbuk Nat'l Univ.) ;
  • Lee, In Hwan (School of Mechanical Engineering, Chungbuk Nat'l Univ.) ;
  • Kim, Ho-Chan (Dept. of Mechanical & Automotive Engineering, Andong Nat'l Univ.) ;
  • Cho, Hae Yong (School of Mechanical Engineering, Chungbuk Nat'l Univ.)
  • 오성택 (충북대학교 정밀기계공학과) ;
  • 이인환 (충북대학교 기계공학부) ;
  • 김호찬 (안동대학교 기계자동차공학과) ;
  • 조해용 (충북대학교 기계공학부)
  • Received : 2014.04.17
  • Accepted : 2014.05.12
  • Published : 2014.08.01

Abstract

It is possible to fabricate a three-dimensional (3D) shape using the solid freeform fabrication (SFF) technology. However, there are several problems in applying conventional SFF technologies to the direct manufacturing of a product. Hence, multimaterial SFF is gaining attention. Moreover, a 3D circuit device that is different from a conventional two-dimensional PCB can also be fabricated using multimaterial SFF. In this study, a hybrid system using fused deposition modeling and direct writing was designed for 3D circuit device fabrication.

Keywords

3-Dimensional Circuit Device;Direct Writing;Solid Freeform Fabrication;Fused Deposition Modeling

Acknowledgement

Supported by : 한국 산업기술진흥원, 한국연구재단

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Cited by

  1. A Study on the Mechanical Properties of Additive Manufactured Polymer Materials vol.39, pp.8, 2015, https://doi.org/10.3795/KSME-A.2015.39.8.773