Mechanical Properties of Porcelain with Thermally and Chemically Induced Residual Stress on Glaze

열적, 화학적 강화에 의해 잔류응력이 형성된 유약층을 가진 도자기의 기계적 물성

  • 김동환 (한국세라믹기술원 엔지니어링세라믹센터) ;
  • 맹지헌 (한국세라믹기술원 엔지니어링세라믹센터) ;
  • 한윤수 (한국세라믹기술원 엔지니어링세라믹센터) ;
  • 김형태 (한국세라믹기술원 엔지니어링세라믹센터) ;
  • 최성철 (한양대학교 신소재공학과) ;
  • 김형준 (한국세라믹기술원 엔지니어링세라믹센터)
  • Received : 2014.05.07
  • Accepted : 2014.07.21
  • Published : 2014.09.30


In this study, we measured the thermally and chemically induced residual stresses on glaze using the photoelastic method. Porcelain with thermally induced residual stress showed compressive stress of 49 MPa for thermal expansion mismatch and a locally fluctuated stress field over the glaze layer due to compensation of compressive stresses around pores. In the case of chemically strengthened porcelain, the compressive stress on the glaze was 151 MPa which was around 3 times higher than the stress on thermally strengthened glaze. The trend of fracture strength of thermally and chemically strengthened porcelains was coincident with that of the residual stress of porcelains.


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