Fabrication of Transparent Conducting Thin Film with High Hardness by Wet Process

습식 공정법에 의한 고경도 투명 전도막 제조

  • Received : 2015.11.18
  • Accepted : 2015.11.24
  • Published : 2015.12.01


Transparent Ag nanowire conducting thin films with high surface hardness were fabricated by bar coating method. When coating speed was changed from 35 mm/sec to 50 mm/sec, the transmittance of coated glass increased from 65.3% to 80.8% in visible light range and the surface resistance was changed from $10.1{\Omega}/sq$ to $23.3{\Omega}/sq$. The surface hardness and adhesion of thin film were 5H and 5B.


Wet process;Conducting film;Ag nanowire;Sol-gel hybrid binder;Hardness


  1. Z. Wu, Z. Chen, X. Du, J. M. Logan, J. Sippel, M. Nikolou, K. Kamaras, J. R. Reynolds, D. B. Tanner, and A. F. Hebard, Science, 305, 1273 (2004). [DOI:]
  2. L. Kim, J. S. Yu, G. H. Jung, J. Jo, J. S. Kim, J. W. Kim, S. W. Kwak, J. L. Lee, and D. Kim, Sol. Energ. Matater. Sol. Cells, 109, 142 (2013). [DOI:]
  3. N. Yamamoto, H. Makino, K. Morisawa, and T. Yamamoto, J. Electrochem. Soc., 41, 29 (2012).
  4. Y. M. Chien, I. Shih, and R. Izquierdo, J. Electrochem. Soc., 35, 69 (2011).
  5. Y. H. Shin, C. K. Cho, and H. K. Kim, Thin Solid Films, 548, 641 (2013). [DOI:]
  6. C. H. Liu and X. Yu, Nanoscale Research Letters, 6, 75 (2011). [DOI:]
  7. L. Hu, H. S. Kim, J. Y. Lee, P. Peumans, and Y. Cui, ACS Nano, 4, 2599 (2010). [DOI:]
  8. N. F. Anglada, J. P. Puigdemont, J. Figueras, M. Z. Iqbal, and S. Roth, Nanoscale Res. Lett., 7, 571 (2012). [DOI:]
  9. H. Z. Geng, K. K. Ki, P. S. Kang, S. L. Young, Y. B. Chang, and H. L. Young, J. Am. Chem. Soc., 129, 7758 (2007). [DOI:]
  10. C. Park, S. W. Kim, Y. S. Lee, S. H. Lee, K. H. Song, and L. S. Park, J. Nanosci. Nanotechnol., 12, 5351 (2012). [DOI:]
  11. K. Bolotin, K. Sikes, Z. Jiang, M. Klima, G. Fudenberg, J. Hone, P. Kim, and H. Stormer, Solid State Communications, 146, 351 (2008). [DOI:]
  12. S. Latil and L. Henrard, Physical Review Letters, 97, 36803 (2006). [DOI:]
  13. B. D. Malhotra, A. Chaubey, and S. P. Singh, Anal. Chim. Acta, 578, 59 (2006). [DOI:]
  14. J. Yang, J. Choi, D. Bang, E. Kim, E. K. Lim, H. Park, J. S. Suh, K. Lee, K. H. Yoo, E. K. Kim, Y. M. Huh, and S. Haam, Angew. Chem. Int. Ed., 50, 441 (2011). [DOI:]
  15. R. Jackson, B. Domercq, R. Jain, B. Kippelen, and S. Graham, Advanced Functional Materials, 18, 2548 (2008). [DOI:]
  16. J. Y. Lee, S. T. Connor, Y. Cui, and P. Peumans, Nano Letters, 8, 689 (2008). [DOI:]
  17. E. M. Doherty, S. De, P. E. Lyons, A. Shmeliov, P. N. Nirmalraj, V. Scardaci, J. Joimel, W. J. Blau, J. J. Boland, and J. N. Coleman, Carbon, 47, 2466 (2009). [DOI:]
  18. Y. Meng, G. Xin, J. W. Nam, S. M. Cho, and H. Y. Chae, J. Nanosci. Nanotechnol., 13, 6125 (2013). [DOI:]
  19. J. Xu, L. Zhang, and G. Chen, Electrophoresis, 34, 2017 (2013). [DOI:]


Supported by : 한국세라믹기술원