LED 칩 제조용 사파이어 웨이퍼 절단을 위한 내부 레이저 스크라이빙 시스템 개발



Kim, Jong-Su;Ryu, Byung-So;Kim, Ki-Beom;Song, Ki-Hyeok;Kim, Byung-Chan;Cho, Myeong-Woo

  • 투고 : 2015.10.21
  • 심사 : 2015.11.11
  • 발행 : 2015.12.31


LED has added value as a lighting source in the illuminating industry because of its high efficiency and low power consumption. In LED production processes, the chip cutting process, which mainly uses a scribing process with a laser has an effect on quality and productivity of LED. This scribing process causes problems like heat deformation, decreasing strength. The inner laser method, which makes a void in wafer and induces self-cracking, can overcome these problems. In this paper, cutting sapphire wafer for fabricating LED chip using the inner laser scribing process is proposed and evaluated. The aim is to settle basic experiment conditions, determine parameters of cutting, and analyze the characteristics of cutting by means of experimentation.


내부 레이저 스크라이빙;레이저 어블레이션;발광다이오드 칩;펄스 레이저;사파이어 웨이퍼


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연구 과제번호 : Z-stocked Multi Focusing기술을 적용한 Thick Epi-Wafer 절단용 Laser System 개발

연구 과제 주관 기관 : 산업통상자원부