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Reliability Testing and Materials Evaluation of Si Sub-Mount based LED Package

실리콘 서브 마운틴 기반의 LED 패키지 재료평가 및 신뢰성 시험

Kim, Young-Pil;Ko, Seok-Cheol
김영필;고석철

  • Received : 2014.12.12
  • Accepted : 2015.01.27
  • Published : 2015.04.30

Abstract

The light emitting diodes(LED) package of new structure is proposed to promote the reliability and lifespan by maximize heat dissipation occurred on the chip. We designed and fabricated the LED packages mixing the advantages of chip on board(COB) based on conventional metal printed circuit board(PCB) and the merits of Si sub-mount using base as a substrate. The proposed LED package samples were selected for the superior efficiency of the material through the sealant properties, chip characteristics, and phosphor properties evaluations. Reliability test was conducted the thermal shock test and flux rate according to the usage time at room temperature, high-temperature operation, high-temperature operation, high-temperature storage, low-temperature storage, high-temperature and high-humidity storage. Reliability test result, the average flux rate was maintained at 97.04% for each items. Thus, the Si sub-mount based LED package is expected to be applicable to high power down-light type LED light sources.

Keywords

Chip On Board(COB);Si Sub-Mount;LED Package;Reliability Test

References

  1. X.Y. Lu, T.C. Hua, M.J. Liu, Y.X. Cheng, "Thermal analysis of loop heat pipe used for high-power LED," Thermochimica Acta vol. 493, no. 1-2, pp. 25-29, Sep. 2009. https://doi.org/10.1016/j.tca.2009.03.016
  2. J.H. Choi, Microelectron. Reliab. "Thermal investigation of LED lighting module," vol. 52, no. 5, pp. 830-835, May 2012. https://doi.org/10.1016/j.microrel.2011.04.009
  3. M.Y. Tsai, C.H. Chen, C.S. Kang, "Thermal measurements and analyses of low-cost high-power LED packages and their modules," Microelectron. Reliab. vol. 52, no. 52, pp. 845-854, May 2012. https://doi.org/10.1016/j.microrel.2011.04.008
  4. H.H. Kim, S.H. Choi, S.H. Shin, Y.K. Lee, S.M. Choi, S. Yi, "Thermal transient characteristics of die attach in high power LED PKG," Microelectron. Reliab. vol. 48, no. 3, pp. 445-454, March 2008. https://doi.org/10.1016/j.microrel.2007.08.009
  5. H. Chen, Y. Lu, Y. Gao, H. Zhang, Z. Chen, "The performance of compact thermal models for LED package," Thermochimica Acta vol. 488, no. 1-2, pp. 33-38, May 2009. https://doi.org/10.1016/j.tca.2008.12.019
  6. M. Maaspuro, A. Tuominen, "Thermal analysis of LED spot lighting device operating in external natural or forced heat convection," Microelectron. Reliab. vol. 53, no. 3, pp. 428-434, March 2013. https://doi.org/10.1016/j.microrel.2012.10.004
  7. Z. Chuluunbaatar, C. Wang, E.S. Kim, N.Y. Kim, "Thermal analysis of a nano-pore silicon-based substrate using a YAG phosphor supported COB packaged LED module," Int. J. Therm. Sci. vol. 86, pp. 307-313, Dec. 2014. https://doi.org/10.1016/j.ijthermalsci.2014.07.013
  8. E. Juntunen, O. Tapaninen, A. Sitomaniemi, V. Heikkinen, "Effect of Phosphor Encapsulant on the Thermal Resistance of a High-Power COB LED Module," IEEE Trans. Compon. Packag. Manuf. Technol. vol. 3, no. 7, pp. 1148-1154, July 2013. https://doi.org/10.1109/TCPMT.2013.2260796
  9. M. Ha, S. Graham, "Development of a thermal resistance model for chip-on-board packaging of high power LED arrays," Microelectron. Reliab. vol. 52, no. 52, pp. 836-844, May 2012. https://doi.org/10.1016/j.microrel.2012.02.005
  10. J.-K. Sim, K. Ashoka, Y.-H. Ra, H.-C. Im, B.-J. Baek, C.-R. Lee, "Characteristic enhancement of white LED lamp using low temperature co-fired ceramic-chip on board package," Current Appl. Phys. vol. 12, no. 2, pp. 494-498, March 2012. https://doi.org/10.1016/j.cap.2011.08.008