DOI QR코드

DOI QR Code

Prediction of Near Magnetic Field Distribution of Switching ICs

스위칭 IC의 근접 자계 분포 예측

Kim, Hyun-Ho;Song, Reem;Lee, Seungbae;Kim, Byung-Sung
김현호;송림;이승배;김병성

  • Received : 2015.08.17
  • Accepted : 2015.10.12
  • Published : 2015.10.30

Abstract

This work presents a method to predict the near magnetic field distribution on the digital switching circuit mounted on PCB using co-simulation of circuit and electromagnetic fields. The proposed method first obtains the normalized near field distribution by exciting the signal and power ports of the switching circuit using sinusoidal sources. Then the real near magnetic field distribution is determined by weighting the normalized field distribution using the current spectrum of the switching circuit. To confirm the proposed method, a switching IC with a ring oscillator and a output buffer is fabricated and measured in the form of chip-on-board. The surface magnetic field distribution is measured using a magnetic probe above the PCB and compared with the simulation results. Experimental results show the correspondence between simulation and measurement results within 10 dB up to fifth harmonics.

Keywords

EMI;Prediction;Near Field Distribution;Switching ICs;Co-Simulation

References

  1. 박학병, 김형근, 박노천, 정규백, "PCB 설계인자의 복사성 EMI 영향 분석", 한국전자파학회지 전자파기술, 14(1), pp. 28-34, 2003년 1월.
  2. Hyun Ho Park, Jin-Hwan Jung, Tae-Sun Jang, Sang-Tae Han, Seung-Hyun Song, Jae-Jin Park, and Hark-Byeong, "Prediction of radiated EMI from PCB excited by switching noise of IC", Microwave and Optical Technology Letters, vol. 51, pp. 2262-2266, 2009. https://doi.org/10.1002/mop.24603
  3. V. Kasturi, S. Deng, T. Hubing, and D. Beetner, "Quantifying electric and magnetic field coupling from integrated circuits with TEM cell measurements", Proc. IEEE International Symposium on Electromagnetic Compatibility, vol. 2, pp. 422-425, Aug. 2006.
  4. Hyun Ho Park, Seung-Hyun Song, Sang-Tae Han, Tae-Sun Jang, Jin-Hwan Jung, and Hark-Byeong Park, "Estimation of power switching current by chip-package-PCB cosimulation", IEEE Transactions on Electromagnetic Compatibility, vol. 52, no. 2, May 2010.
  5. www.langer-emv.de

Acknowledgement

Supported by : 한국연구재단