Evaluation of Mechanical Property for Pb-free Solder/Ni Plate Joints with Artificial Aging Time

인공시효시간에 따른 Ni 기판 Pb-free 솔더접합부의 기계적 물성평가

  • Park, So Young (School of Mechanical System Engineering, Chonbuk Nat'l Univ.) ;
  • Yang, Sung Mo (School of Mechanical System Engineering, Chonbuk Nat'l Univ.) ;
  • Yu, Hyo Sun (School of Mechanical System Engineering, Chonbuk Nat'l Univ.)
  • 박소영 (전북대학교 기계시스템공학부) ;
  • 양성모 (전북대학교 기계시스템공학부) ;
  • 유효선 (전북대학교 기계시스템공학부)
  • Received : 2014.03.05
  • Accepted : 2015.02.28
  • Published : 2015.05.01


Thus far, solders used in electronics remain lead-based. Pb-free solutions in electronic components and systems are receiving increased attention in the semiconductor and electronics industries. Pb-free materials currently in used are Sn-37Pb, Sn-4Ag and Sn-4Ag-0.5Cu/Ni plate joints. In this study, solder alloys were used at high temperatures for artificial aging processing that was performed at $150^{\circ}C$ for 0hr, 100hr, 200hr, 400hr, 600hr and 1000hr. The SP test was conducted at $30^{\circ}C$ and $50^{\circ}C$. As a result, the maximum shear strength of all the specimens decreased with the increase in artificial aging time and temperature of the SP test. In addition, Pb-free solders showed higher total fracture energy compared with Sn-37Pb at high temperatures. The mechanical properties of Sn-4Ag-0.5Cu solder/Ni plate joints remained in excellent conditions in electronic parking systems at high temperatures.


Supported by : 한국연구재단


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