Investigation of Glass Substrate Sealing for ECL Application using Laser Welding Technology

레이저 웰딩 기술을 이용한 ECL용 유리 기판 접합에 대한 고찰

  • Received : 2015.04.27
  • Accepted : 2015.12.01
  • Published : 2015.12.31


In this work, we reported fabrication of sealing the glass substrate using laser treatment at low temperature for electrochemical luminescence (ECL) cell. The laser treatment at temperature is using laser diode. The glass substrate sealing by laser treatment tested at 3-10W, 2-5 mm/s for build and tested. The sealing laser treatment method will allow associate coordination between the two glass substrate was enclosed. The effect of laser treatment to sealing the glass substrate was found to have cracks and air gap at best thickness of about 550-600 im for condition 3 W, 3 mm/s. The surface of sealing was roughness which was not influent to electrodes It can reduce the cracks, crevices and air gaps as well, improves the performance viscosity in butter bus bar electrodes. Therefore, it is more effective viscosity between two FTO glasses substrate.


Electrochemi-luminescence;Fluorine-doped tin oxide glass;Glass frit;Laser sealing;Laser welding


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Supported by : 한국연구재단