CNT-Ag 복합패드가 Cu/Au 범프의 플립칩 접속저항에 미치는 영향



Choi, Jung-Yeol;Oh, Tae Sung

  • 투고 : 2015.08.31
  • 심사 : 2015.09.18
  • 발행 : 2015.09.30


이방성 전도접착제를 이용하여 Cu/Au 칩 범프를 Cu 기판 배선에 플립칩 실장한 접속부에 대해 CNT-Ag 복합패드가 접속저항에 미치는 영향을 연구하였다. CNT-Ag 복합패드가 내재된 플립칩 접속부가 CNT-Ag 복합패드가 없는 접속부에 비해 더 낮은 접속저항을 나타내었다. 각기 25 MPa, 50 MPa 및 100 MPa의 본딩압력에서 CNT-Ag 복합패드가 내재된 접속부는 $164m{\Omega}$, $141m{\Omega}$$132m{\Omega}$의 평균 접속저항을 나타내었으며, CNT-Ag 복합패드를 형성하지 않은 접속부는 $200m{\Omega}$, $150m{\Omega}$$140m{\Omega}$의 평균 접속저항을 나타내었다.


stretchable packaging;flexible packaging;CNT-metal;flip chip;contact resistance


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연구 과제번호 : 인간친화형 디바이스(스킨패치, 멀티모달 서피스) 및 디바이스 소셜 프레임워크 기술 개발

연구 과제 주관 기관 : 정보통신기술진흥센터