Journal of the Korean Applied Science and Technology (한국응용과학기술학회지)
- Volume 32 Issue 3
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- Pages.512-521
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- 2015
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- 1225-9098(pISSN)
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- 2288-1069(eISSN)
DOI QR Code
Preparation of Soft Etchant to Improve Adhesion Strength between Photoresist and Copper Layer in Copper Clad Laminates
CCL 표면과 포토리지스트와의 접착력 향상 위한 Soft 에칭액의 제조
- Lee, Soo (Department of Chemical Engineering, Changwon National University) ;
- Moon, Sung-Jin (Department of Chemical Engineering, Changwon National University)
- Received : 2015.08.10
- Accepted : 2015.09.30
- Published : 2015.09.30
Abstract
In this research, environmental friendly organic acid containing microetching system to improve adhesion strength between photoresist resin and Copper Clad Laminate(CCL) was developed without using strong oxidant
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References
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