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Preparation of Soft Etchant to Improve Adhesion Strength between Photoresist and Copper Layer in Copper Clad Laminates

CCL 표면과 포토리지스트와의 접착력 향상 위한 Soft 에칭액의 제조

  • Lee, Soo (Department of Chemical Engineering, Changwon National University) ;
  • Moon, Sung-Jin (Department of Chemical Engineering, Changwon National University)
  • 이수 (창원대학교 화공시스템공학과) ;
  • 문성진 (창원대학교 화공시스템공학과)
  • Received : 2015.08.10
  • Accepted : 2015.09.30
  • Published : 2015.09.30

Abstract

In this research, environmental friendly organic acid containing microetching system to improve adhesion strength between photoresist resin and Copper Clad Laminate(CCL) was developed without using strong oxidant $H_2O_2$. Etching rate and surface contamination on CCL were examined with various etching conditions with different etchants, organic acids and additives. to develope an optimum microetching condition. Etching solution with 0.04 M acetic acid showed the highest etching rate $0.4{\mu}m/min$. Etching solution with the higher concentration of APS showed the higher etching rate but surface contamination on CCL is very serious. In addition, stabilizer solution also played an important role to control the surface contamination. As a result of research, the etching solution containing 0.04 M of acetic acid, 0.1 M of APS with 4 g/L of stabilizer solution(ST-1) was best to improve adhesion between CCL and photoresist resin as well as showed the most clean and rough surface with the etching rate of $0.37{\mu}m/min$.

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