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Etchless Fabrication of Cu Circuits Using Wettability Modification and Electroless Plating

젖음성 차이와 무전해도금을 이용한 연성 구리 회로패턴 형성

  • Park, Sang-Jin (Department of Materials Science and Engineering, Chungnam National University) ;
  • Ko, Tae-Jun (Computational Science Research Center, Korea Institute of Science and Technology) ;
  • Yoon, Juil (Department of Mechanical System Engineering, Hansung University) ;
  • Moon, Myoung-Woon (Computational Science Research Center, Korea Institute of Science and Technology) ;
  • Han, Jun Hyun (Department of Materials Science and Engineering, Chungnam National University)
  • 박상진 (충남대학교 신소재공학과) ;
  • 고태준 (한국과학기술연구원 계산과학연구센터) ;
  • 윤주일 (한성대학교 기계시스템 공학과) ;
  • 문명운 (한국과학기술연구원 계산과학연구센터) ;
  • 한준현 (충남대학교 신소재공학과)
  • Received : 2015.09.16
  • Accepted : 2015.10.11
  • Published : 2015.11.27

Abstract

Cu circuits were successfully fabricated on flexible PET(polyethylene terephthalate) substrates using wettability difference and electroless plating without an etching process. The wettability of Cu plating solution on PET was controlled by oxygen plasma treatment and $SiO_x$-DLC(silicon oxide containing diamond like carbon) coating by HMDSO(hexamethyldisiloxane) plasma. With an increase of the height of the nanostructures on the PET surface with the oxygen plasma treatment time, the wettability difference between the hydrophilicity and hydrophobicity increased, which allowed the etchless formation of a Cu pattern with high peel strength by selective Cu plating. When the height of the nanostructure was more than 1400 nm (60 min oxygen plasma treatment), the reduction of the critical impalement pressure with the decreasing density of the nanostructure caused the precipitation of copper in the hydrophobic region.

Acknowledgement

Grant : 신소재 융합기술 인력양성사업단

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