Thermal Analysis for Improvement of Heat Dissipation Performance of the Rail Anchoring Failure Detection Module

레일 체결구 결함 검측 모듈의 방열성능 개선을 위한 열 해석

Chae, Won kyu;Park, Young;Kwan, Sam young;Lee, Jaehyeong

  • Received : 2015.10.27
  • Accepted : 2016.01.24
  • Published : 2016.02.01


In this paper, various heat dissipation designs for a rail anchoring failure detection module were investigated by a thermal flow analysis. For the detection module with the heat dissipation design on the overall housing surface, an average temperature inside the module was lowered by $25^{\circ}C$ when compared to no heat dissipation design. In addition, an internal heat-flow blocking layer and an heat conduction layer inserted between the LED module and housing case were effective in reducing the temperature in the rail anchoring failure detection, which has a limited space for installation and little air flow. Especially, the temperature near LED module decreased below $55^{\circ}C$ when the optimal heat dissipation design was applied.


Rail anchoring measurement module;Heat flow simulation;Heat dissipation design;Heat conduction


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Grant : 고속 궤도 검측 모듈 개발

Supported by : 국토교통과학기술진흥원