- Volume 29 Issue 3
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A Study on The Degradation Characteristics of MLCCs SAC305 Lead-Free Solder Joints and Growth IMCs by Thermal Shock Test
열충격 시험을 통한 MLCCs SAC305 무연 솔더 접합부의 IMCs 성장과 접합특성 저하에 관한 연구
- Jung, Sang-Won (School of Mechanical Engineering, Chung-Ang University) ;
- Kang, Min-Soo (School of Mechanical Engineering, Chung-Ang University) ;
- Jeon, Yu-Jae (School of Mechanical Engineering, Chung-Ang University) ;
- Kim, Do-Seok (School of Mechanical Engineering, Chung-Ang University) ;
- Shin, Young-Eui (School of Mechanical Engineering, Chung-Ang University)
- Received : 2016.02.10
- Accepted : 2016.02.21
- Published : 2016.03.01
The bonding characteristics of MLCCs (multi layer ceramic capacitor, C1608) lead-free solder (SAC305) joints were evaluated through thermal shock test (
Supported by : (주)창성
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