A Study on The Degradation Characteristics of MLCCs SAC305 Lead-Free Solder Joints and Growth IMCs by Thermal Shock Test

열충격 시험을 통한 MLCCs SAC305 무연 솔더 접합부의 IMCs 성장과 접합특성 저하에 관한 연구

  • Jung, Sang-Won (School of Mechanical Engineering, Chung-Ang University) ;
  • Kang, Min-Soo (School of Mechanical Engineering, Chung-Ang University) ;
  • Jeon, Yu-Jae (School of Mechanical Engineering, Chung-Ang University) ;
  • Kim, Do-Seok (School of Mechanical Engineering, Chung-Ang University) ;
  • Shin, Young-Eui (School of Mechanical Engineering, Chung-Ang University)
  • Received : 2016.02.10
  • Accepted : 2016.02.21
  • Published : 2016.03.01


The bonding characteristics of MLCCs (multi layer ceramic capacitor, C1608) lead-free solder (SAC305) joints were evaluated through thermal shock test ($-40^{\circ}C{\sim}125^{\circ}C$, total 1,800 cycle). After the test, IMCs( intermetallic compounds) growth and cracks were verified, also shear strengths were measured for degradation of solder joints. In addition, The thermal stress distributions at solder joints were analyzed to compare the solder joints changes before and after according to thermal shock test by FEA (finite elements analysis). We considered the effects of IMCs growth at solder joints. As results, the bonding characteristics degradation was occurred according to initial crack, crack propagations and thermal stress concentration at solder-IMCs interface, when the IMCs grown to solder inside.


Supported by : (주)창성


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