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Verification Study of Lifetime Prediction Models for Pb-Based and Pb-Free Solders Used in Chip Resistor Assemblies Under Thermal Cycling

온도변화 환경에서 칩저항 실장용 유·무연솔더의 수명모델 검증연구

  • Han, Changwoon (Robust Components and System Research Center, Korea Electronics Technology Institute)
  • 한창운 (전자부품연구원 시스템로버스트연구센터)
  • Received : 2015.05.03
  • Accepted : 2015.12.26
  • Published : 2016.03.01

Abstract

Recently, life prediction models for Pb-based and Pb-free solders used in chip resistor assemblies under thermal cycling have been introduced. The models suggest that the field lifetimes of Pb-free solders would be better than those of Pb-based solders when used for chip resistors under thermal cycling conditions, while the lifetime of the chip assemblies under accelerated test conditions show a reverse relationship. In this study, the prediction models were verified by applying the model to another research case. Finite element models were built, thermal cycling conditions were applied, and the energy densities were calculated. Finally, life prediction analysis was conducted for the cases where Pb-based and Pb-free solders were used. The prediction results were then compared with the test data of the case. It was verified that the predictions of the developed life cycle models are on the practical scale.

Keywords

Lifetime Prediction Model;Pb-free Solder;Accelerated Life Test;Chip Resistor

Acknowledgement

Supported by : 한국산업기술평가관리원

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