온도변화 환경에서 칩저항 실장용 유·무연솔더의 수명모델 검증연구

Verification Study of Lifetime Prediction Models for Pb-Based and Pb-Free Solders Used in Chip Resistor Assemblies Under Thermal Cycling

  • 한창운 (전자부품연구원 시스템로버스트연구센터)
  • Han, Changwoon (Robust Components and System Research Center, Korea Electronics Technology Institute)
  • 투고 : 2015.05.03
  • 심사 : 2015.12.26
  • 발행 : 2016.03.01


최근에 온도변화 환경에서 칩저항 실장용 유 무연 솔더의 수명예측모델이 개발되었다. 개발된 수명예측모델에 의하면 가속조건에서는 칩저항 실장 무연솔더가 유연솔더보다 수명이 적은 것으로 나타나지만, 실제조건에서는 무연솔더의 신뢰성이 유연솔더보다 우수하다. 본 연구에서는 개발된 수명예측모델의 검증 연구를 수행한다. 수명예측모델을 다른 칩저항 실장 유 무연 솔더 시험 결과에 적용하고 비교하기 위해서, 유한요소모델을 개발하고 시험 온도사이클 조건을 적용한다. 변형율 에너지 밀도를 계산하고 수명을 예측한다. 마지막으로 유 무연 솔더에 대해서 예측결과를 시험결과와 비교한다. 검증 결과는 개발된 수명예측모델이 사용 가능한 범위에서 수명을 예측할 수 있음을 보인다.


수명예측모델;무연 솔더;가속수명시험;칩저항


연구 과제 주관 기관 : 한국산업기술평가관리원


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