DOI QR코드

DOI QR Code

Electrical Properties and Microstructures in Ti Films Deposited by TFT dc Sputtering

  • Han, Chang-Suk ;
  • Jeon, Seung-Jin
  • Received : 2016.02.03
  • Accepted : 2016.03.10
  • Published : 2016.04.27

Abstract

Ti films were deposited on glass substrates under various preparation conditions in a chamber of two-facing-target type dc sputtering; after deposition, the electric resistivity values were measured using a conventional four-probe method. Crystallographic orientations and microstructures, including the texture and columnar structure, were also investigated for the Ti films. The morphological features, including the columnar structures and surface roughness, are well explained on the basis of Thornton's zone model. The electric resistivity and the thermal coefficient of the resistivity vary with the sputtering gas pressure. The minimum value of resistivity was around 0.4 Pa for both the $0.5{\mu}m$ and $3.0{\mu}m$ thick films; the apparent tendencies are almost the same for the two films, with a small difference in resistivity because of the different film thicknesses. The films deposited at high gas pressures show higher resistivities. The maximum of TCR is also around 0.4 Pa, which is the same as that obtained from the relationship between the resistivity and the gas pressure. The lattice spacing also decreases with increasing sputtering gas pressure for both the $0.5{\mu}m$ and $3.0{\mu}m$ thick films. Because they are strongly related to the sputtering gas pressures for Ti films that have a crystallographic anisotropy that is different from cubic symmetry, these changes are well explained on the basis of the film microstructures. It is shown that resistivity measurement can serve as a promising monitor for microstructures in sputtered Ti films.

Keywords

Ti films;electric resistivity;crystallographic orientation;microstructure;thermal coefficient

References

  1. C. S. Oh and C. S. Han, Korean J. Mater. Res., 24, 344 (2014). https://doi.org/10.3740/MRSK.2014.24.7.344
  2. C. H. Bae, J. H. Lee and C. S. Han, J. Korean Soc. Heat Treat., 22, 143 (2009).
  3. V. E. Saouma, S. Y. Chang and O. Sbaizero, Compos. B:Eng., 37, 550 (2006). https://doi.org/10.1016/j.compositesb.2006.02.016
  4. J. A. Thornton, J. Vac. Sci. Technol., 11, 666 (1974). https://doi.org/10.1116/1.1312732
  5. T. Oya and E. Kusano, Thin Solid Films, 517, 5837 (2009). https://doi.org/10.1016/j.tsf.2009.03.055
  6. A. Flink, T. Larsson and J. Sjolen, Surf. Coat. Technol., 200, 1535 (2005). https://doi.org/10.1016/j.surfcoat.2005.08.096
  7. Y. Hoshi, M. Naoe and S. Yamanaka, Jpn. J. Appl. Phys., 16, 1715 (1977). https://doi.org/10.1143/JJAP.16.1715
  8. R. Zuberek, E. Mosiniewicz-Szablewska and H. Szymczak, Phys. B: Condens. Matter., 284, 1237 (2000).
  9. M. Takahashi and T. Shimatsu, IEEE Trans. Mag., 26, 1485 (1990). https://doi.org/10.1109/20.104420
  10. A. F. Jankowski and T. O. Wilford, J. Metals, 22, 28 (1987).

Acknowledgement

Supported by : Ministry of Trade, Industry and energy(MOTIE)