DOI QR코드

DOI QR Code

Microstructure and Dielectric Properties of Low Temperature Sintering (Ba0.86Ca0.14)(Ti0.85Zr0.12Sn0.03)O3 System Ceramics

저온소결 (Ba0.86Ca0.14)(Ti0.85Zr0.12Sn0.03)O3계 세라믹스의 미세구조와 유전 특성

  • Received : 2016.04.16
  • Accepted : 2016.05.09
  • Published : 2016.07.01

Abstract

In this study, to develop low temperature sintering capacitor composition ceramics with the good dielectric properties, $(Ba_{0.86}Ca_{0.14})(Ti_{0.85}Zr_{0.12}Sn_{0.03})O_3$ (BCTZ) ceramics were prepared by the conventional solid-state reaction method. The effects of $B_2O_3$ addition on the dielectric properties and microstructure was investigated. The XRD patterns demonstrated that all the specimens showed Perovskite phase, and secondary phases are indicated in the measurement range of XRD. And also, temperature coefficient of capacitance(TCC) of all the specimen sintered at $1,180^{\circ}C$ showed +3~-56% except for x=0.006. For all the specimens, observed one peak was tetragonal cubic difuse phase transition temperature(Tc), which is located in the vicinity of room temperature.

Keywords

Dielectric properties;Microstructure;$BCTZSO_3$;$B_2O_3$

References

  1. S. H. Shin, J. D. Han, and J. H. Yoo, Mater. Lett., 154, 120 (2015). [DOI: http://dx.doi.org/10.1016/j.matlet.2015.03.121] https://doi.org/10.1016/j.matlet.2015.03.121
  2. S. H. Shin, J. H. Yoo, and S. D. Lee, Ferroelectr. Lett. Section, 41, 1 (2014). [DOI: http://dx.doi.org/10.1080/07315171.2014.908678] https://doi.org/10.1080/07315171.2014.908678
  3. S. M. Rhim, S. M. Hong, H. J. Bak, and O. K. Kim, J. Korean Ceram. Soc., Lett., 36, 767 (1999).
  4. D. K. Yim, J. R. Kim, D. W. Kim, K. S. Hong, J. Eur. Ceram. Soc. Lett., 27, 3053 (2007). [DOI: http://dx.doi.org/10.1016/j.jeurceramsoc.2006.11.029] https://doi.org/10.1016/j.jeurceramsoc.2006.11.029
  5. J. G. Fisher, D. G. Lee, H. H. Oh, H. N. Kim, D. Nguyen, J. H. Kim, J. S. Lee and H. Y. Lee, J. Korean Ceram. Soc. Lett., 50, 157 (2013). https://doi.org/10.4191/kcers.2013.50.2.157
  6. Q. Zeng, W. Li, J. L. Shi, J. K. Guo, H. Chen, M. L. Liu, J. Eur. Ceram. Soc.. Lett., 27, 261 (2007). [DOI: http://dx.doi.org/10.1016/j.jeurceramsoc.2006.04.174] https://doi.org/10.1016/j.jeurceramsoc.2006.04.174
  7. B. J. Kim, M. H. Kim, S. Nahm, H. T. Kim, J. H. Kim, J. H. Paik, H. Ryu, H. J. Lee, J. Eur. Ceram. Soc.. Lett., 27, 1065 (2007). [DOI: http://dx.doi.org/10.1016/j.jeurceramsoc.2006.05.060] https://doi.org/10.1016/j.jeurceramsoc.2006.05.060
  8. S. H. Shin, J. H. Yoo, and D. C. Shin, Korean Inst. Electr. Electron. Mater. Eng., 27, 797 (2014).
  9. G. M. Lee, J. H. Yoo, and J. Y. Lee, J. Korean Inst. Electr. Electron. Mater. Eng., 28, 690 (2015).