Improvement on Surface and Electrical Properties of Polymer Insulator Coated TiO2 Thin Film by Atomic Layer Deposition

원자층 증착장치에 의한 TiO2 박막 코팅된 폴리머 절연체의 표면 및 전기적 특성의 향상

Kim, Nam-Hoon;Park, Yong Seob

  • Received : 2016.06.02
  • Accepted : 2016.06.13
  • Published : 2016.07.01


Titanium oxide ($TiO_2$) thin films were synthesized on polymer insulator and Si substrates by atomic layer deposition (ALD) method. The surface and electrical properties of $TiO_2$ films synthesized at various ALD cycle numbers were investigated. The synthesized $TiO_2$ films exhibited higher contact angle and smooth surface. The contact angle of $TiO_2$ films was increased with the increase of ALD-cycle number. Also, the rms surface roughness of films was slightly rough with the increase of ALD-cycle number. The leakage current on $TiO_2$ film surface synthesized at various conditions were uniformed, and the values were decreased with the increase of ALD-cycle number. In the results, the performance of $TiO_2$ films for self-cleaning critically depended on a number of ALD-cycle.


$TiO_2$;Atomic layer deposition (ALD);Contact angle;Leakage current;Rms surface roughness


  1. J. M. Kim, T. W. Nam, S. J. Lim, Y. G. Seol, N. E. Lee, D. Y. Kim, and H. Kim, Appl. Phys. Lett., 98, 142113 (2011). [DOI:]
  2. E. Guziewicz, I. A. Kowalik, M. Godlewski, K. Kopalko, V. Osinniy, A. Wojcik, S. Yatsunenko, E. Usakowska, W. Paszkowicz, and M. Guziewicz, J. Appl. Phys., 103, 033515 (2008). [DOI:]
  3. J. Sheng, N. Yoshida, J. Karasawa, and T. Fukami, Sens. Actuators B, 41, 131 (1997). [DOI:]
  4. J. K. Luo, Y. Q. Fu, H. R. Le, J A. Williams, S. M. Spearing, and W. I. Milne, J. Micromech. Microeng., 17, S147 (2007). [DOI:]
  5. D. Sheeja, B. K. Tay, S. P. Lau, and X. Shi, Wear, 249, 433 (2001). [DOI:]
  6. M. Schlatter, Diam. Relat. Mater., 11, 1781 (2002). [DOI:]
  7. J. Aarik, A. Aidla, T. Uustare, M. Ritala, and M. Leskela, Appl. Surf. Sci., 161, 385 (2000). [DOI:]
  8. J. P. Lee and M. M. Sung, J. Am. Chem. Soc., 126, 28 (2004). [DOI:]
  9. T. Suntola, Thin Solid Films, 216, 84 (1992). [DOI:]
  10. W. R. Hansen and K. Autumn, Proc. Natl. Acad. Sci. USA, 102, 385 (2005). [DOI:]
  11. M. Ma and R. M. Hill, Curr. Opin. Colloid Interface Sci., 11, 193 (2006). [DOI:]
  12. M. Heikkila, E. Puukilainen, M. Ritala, M. Leskela, Journal of Photochemistry and Photobiology A: Chemistry, 204, 200 (2009). [DOI:]
  13. A. Fujishima, X. Zhang, and D. A. Tryk, Surface Science Reports, 63, 515 (2008). [DOI:]
  14. G. J. Choi, S. K. Kim, S. J. Won, H. J. Kim, and C. S. Hwang, Journal of The Electrochemical Society, 156, G138-G143 (2009). [DOI:]
  15. S. K. Kim, W. D. Kim, K. M. Kim, C. S. Hwang, and J. Jeong, Appl. Phys. Lett., 85, 4112 (2004). [DOI:]
  16. S. K. Kim, G. W. Hwang, W. D. Kim, and C. S. Hwang, Electrochem. Solid-State Lett., 9, F5 (2006). [DOI:]