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Study on the Properties of UV Curing Thermal Conductive and Pressure Sensitive Adhesive Using Inorganic Fillers

  • Oh, Ji-Hwan (School of Energy, Materials, Chemical Engineering, Korea of Technology and Education, Korea University of Technology and Education) ;
  • Choi, Jin-Yeong (School of Energy, Materials, Chemical Engineering, Korea of Technology and Education, Korea University of Technology and Education) ;
  • Kim, Su-Hwan (School of Energy, Materials, Chemical Engineering, Korea of Technology and Education, Korea University of Technology and Education) ;
  • Jang, Se-Hoon (School of Energy, Materials, Chemical Engineering, Korea of Technology and Education, Korea University of Technology and Education) ;
  • Shin, Yoo-Jin (School of Energy, Materials, Chemical Engineering, Korea of Technology and Education, Korea University of Technology and Education) ;
  • Kim, Dae-Hyun (School of Energy, Materials, Chemical Engineering, Korea of Technology and Education, Korea University of Technology and Education) ;
  • Yoo, Hwan-Kyu (School of Energy, Materials, Chemical Engineering, Korea of Technology and Education, Korea University of Technology and Education) ;
  • Cho, Ur Ryong (School of Energy, Materials, Chemical Engineering, Korea of Technology and Education, Korea University of Technology and Education)
  • Received : 2017.02.03
  • Accepted : 2017.02.20
  • Published : 2017.03.31

Abstract

The thermal conductivity and the adhesive properties were measured, after synthesis of thermal conductive composite which was obtained as a result of mixing alumina or graphite with acrylic adhesive synthesized by UV polymerization. The adhesive properties of the composite were evaluated measuring the peel strength at 180 degrees, the retention, and the initial tack;the thermal conductivity was estimated using laser flash analysis. As the filler contents increased, a decrease in peel strength and initial tack and an increase in retention and thermal conductivity were observed. When compared to alumina, the adhesion of graphite showed a dramatic decrease, whereas the thermal conductivity was further enhanced. It was found out that the small size of graphite increased the mechanical interlocking between the polymer and the filler, and it was easier for graphite to come into contact with other graphite in the matrix.

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