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A Study on the Prediction of the Mechanical Properties of Printed Circuit Boards Using Modal Parameters

모달 파라미터 정보를 활용한 PCB 물성 예측에 관한 연구

  • Received : 2016.08.08
  • Accepted : 2017.01.17
  • Published : 2017.05.01

Abstract

In this study, we propose a method for predicting the mechanical properties of the printed circuit board (PCB) that has transversely isotropic characteristics. Unlike the isotropic material, there is no specific test standard for acquisition of the transversely isotropic properties. In addition, common material test methods are not readily applicable to that type of laminated thin plate. Utilizing the natural frequency obtained by a modal test and the sizing optimization technique provided in $OptiStruct^{(R)}$, the mechanical properties of a PCB were derived to minimize the difference between test and analysis results. In addition, the validity of the predicted mechanical properties was confirmed by the MAC (Modal Assurance Criteria) value of each of the compared mode shapes. This proposed approach is expected to be extended to the structural analysis for the design verification of the top product that includes a PCB.

Keywords

Transversely Isotropic Property;Copper Clad Laminate;Rules of Mixture;Size Optimization;Multilayer Printed Circuit Board

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