Thermal Decomposition Behavior of LCT Composites Using Boron Nitride Filler

Boron Nitride를 함유한 열경화성 액정 에폭시의 열분해 거동

  • Hwangbo, Sejin (Department of Organic Materials and Fiber Engineering, Soongsil University) ;
  • Cho, Seung Hyun (Department of Organic Materials and Fiber Engineering, Soongsil University)
  • 황보세진 (숭실대학교 유기신소재파이버공학과) ;
  • 조승현 (숭실대학교 유기신소재파이버공학과)
  • Received : 2018.01.02
  • Accepted : 2018.02.15
  • Published : 2018.02.28


A liquid crystalline thermosetting-epoxy-based composite was fabricated using diglycidyl ether of 4,4'-biphenol, boron nitride as the filler, and sulfanilamide as the curing agent. To investigate the thermal behavior, thermogravimetric analysis was performed, and temperature differences of the sample were recorded when using 1.0-7.0 wt.% boron nitride. The activation energy for thermal decomposition was calculated using the Kissinger method and Flynn-wall method. The results showed that the activation energy was proportional to the amount of added filler.


Supported by : 한국연구재단


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