Fabrication and Evaluation of Heat Transfer Property of 50 Watts Rated LED Array Module Using Chip-on-board Type Ceramic-metal Hybrid Substrate

Chip-on-board 형 세라믹-메탈 하이브리드 기판을 적용한 50와트급 LED 어레이 모듈의 제조 및 방열특성 평가

  • Heo, Yu Jin (Nano Materials and Convergence Center, Korea Institute of Ceramic Engineering and Technology) ;
  • Kim, Hyo Tae (Nano Materials and Convergence Center, Korea Institute of Ceramic Engineering and Technology)
  • 허유진 (한국세라믹기술원 나노융합소재센터) ;
  • 김효태 (한국세라믹기술원 나노융합소재센터)
  • Received : 2018.12.04
  • Accepted : 2018.12.28
  • Published : 2018.12.31


This paper describes the fabrication and heat transfer property of 50 watts rated LED array module where multiple chips are mounted on chip-on-board type ceramic-metal hybrid substrate with high heat dissipation property for high power street and anti-explosive lighting system. The high heat transfer ceramic-metal hybrid substrate was fabricated by conformal coating of thick film glass-ceramic and silver pastes to form insulation and conductor layers, using thick film screen printing method on top of the high thermal conductivity aluminum alloy heat-spreading panel, then co-fired at $515^{\circ}C$. A comparative LED array module with the same configuration using epoxy resin based FR-4 PCB with thermalvia type was also fabricated, then the thermal properties were measured with multichannel temperature sensors and thermal resistance measuring system. As a result, the thermal resistance of the ceramic-metal hybrid substrate in the $4{\times}9$ type LEDs array module exhibited about one third to the value as that of FR-4 substrate, implying that at least triple performance of heat transfer property as that of FR-4 substrate was realized.

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Fig. 1. Schematic illustration of chip-on-board (COB) type LED array module with ceramic-metal PCB: (a) single chip and (b) multichip mounted module.

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Fig. 2. Circuit diagram of 50 watts rated LED array module consisted of 36 LED chips.

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Fig. 3. Schematic illustration of LED array module with thermal-via type FR-4 PCB: (a) single chip and (b) multichip mounting module.

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Fig. 4. Optical images of fabricated 50 watts rated LED array module panels: circuit layout of 4 × 9 LEDs arrayed on ceramic-metal hybrid PCB panel (a) without top protection layer, (b) with top protection layer, and (c) comparative LED array module made with thermal-via FR-4 PCB.

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Fig. 5. Measurement of Ta in 50 watts LED array modules using multipoint temperature sensors (without thermal tape): (a) with COB type ceramic-metal PCB, (b) temperature measuring point, and (c) with thermal-via type FR-4 PCB.

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Fig. 6. (a) Thermal resistance data obtained by cumulative structure functions of 50 watts rated 4 × 9 LEDs array modules with (I) COB type ceramic-metal PCB and (II) thermal-via type FR-4 PCB and (b) equivalent thermal resistances and thermal capacitances circuit by Cauer-type RC ladder model.


Supported by : Small & Medium Business Administration (SMBA)


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