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Thermal Decomposition Behavior of Liquid Crystalline Epoxy-Based Composites

열경화성 액정 에폭시 매트릭스 복합재료의 열분해 거동 비교

  • Park, Jonghyun (Department of Organic Materials and Fiber Engineering, Soongsil University) ;
  • Cho, Seung Hyun (Department of Organic Materials and Fiber Engineering, Soongsil University)
  • 박종현 (숭실대학교 유기신소재.파이버공학과) ;
  • 조승현 (숭실대학교 유기신소재.파이버공학과)
  • Received : 2018.08.20
  • Accepted : 2018.10.01
  • Published : 2018.10.31

Abstract

Thermosetting liquid crystalline epoxy is an epoxy polymer that forms a liquid crystalline network structure upon curing. 4,4'-Diglycidyloxybiphenyl with an aromatic rigid-rod part such as a biphenyl group exhibits liquid crystallinity. Biphenol epoxy resin (BP), which is cured by using sulfanilamide, forms a liquid crystalline network by reacting the amine and epoxy ring of sulfanilamide and biphenol. In this experiment, silicon nitride (Si3N4) or aluminum nitride (AlN) was used as a filler. The activation energy required for the decomposition was calculated using the Kissinger method and the Flynn-wall method to confirm the thermal properties of the thermosetting liquid crystalline epoxy with silicon nitride. As a result, the activation energy required for decomposition of the composite increased with increasing silicon nitride content, and it was confirmed that silicon nitride increased the thermal stability of the thermosetting liquid crystalline epoxy.

Acknowledgement

Supported by : 한국연구재단

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