DOI QR코드

DOI QR Code

A Numerical Study on Air Distribution and Flow in the Passenger Cabin of a High-Speed Electric Train

고속전철 객실의 공기 분배 및 기류에 관한 수치해석적 연구

Myong, Hyon-Kook;Yoo, Kyung-Hoon;Hwang, Jungho
명현국;유경훈;황정호

  • Received : 2019.03.25
  • Accepted : 2019.03.29
  • Published : 2019.03.31

Abstract

Numerical analysis has been conducted on three-dimensional airflow distribution in the passenger cabin of a high-speed electric train. The types of air distribution systems investigated in the present study were those of TGV and Shinkansen. The Reynolds-averaged Navier-Stokes equations governing the mass and momentum conservations of the airflow in the cabin were solved by using a finite volume method, which are coupled with the standard $k-{\varepsilon}$ turbulence model equations. Predicted velocity distributions were presented on several selected planes in the passenger cabin. The present three-dimensional simulations were found to show the overall features of the airflow in the passenger cabin fairly well. In particular, it was shown that the type of air distribution for Shinkansen was more suitable for a non-smoking cabin than that for TGV.

Keywords

Numerical Analysis;High-Speed Electric Train;Passenger Cabin;Air Distribution;Air Flow

References

  1. Daewoo-Carrier (1997). Development of HVAC and pressurization system for high speed electric trains, The First Annual Report, Korean Ministry of Land, Infrastructure and Transport, Korean Ministry of Trade, Industry and Energy and Korean Ministry of Science and Technology.
  2. Myong, H.K., Park, H.K., and Jin, E. (1996). Simulation of three-dimensional turbulent flows around an ahmed body-Evaluation of finite differencing schemes, Transactions of the KSME, 20(11), 47-50.
  3. Rhie, C.-M., and Chow, W.L. (1983). Numerical study of the turbulent flow past an airfoil with trailing edge separation, AIAA Journal, 21(11), 1525-1532. https://doi.org/10.2514/3.8284
  4. Yoo, K.H., Oh, M.D., and Myong, H.K. (1995). Analysis of particle deposition onto a heated or cooled, horizontal free-standing wafer surface, Transactions of the KSME, 19(5), 1319-1332.