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Elastic Properties and Repeated Deformation Reliabilities of Stiffness-Gradient Stretchable Electronic Packages

강성도 경사형 신축 전자패키지의 탄성특성 및 반복변형 신뢰성

  • Han, Kee Sun (Department of Materials Science and Engineering, Hongik University) ;
  • Oh, Tae Sung (Department of Materials Science and Engineering, Hongik University)
  • 한기선 (홍익대학교 공과대학 신소재공학과) ;
  • 오태성 (홍익대학교 공과대학 신소재공학과)
  • Received : 2019.11.28
  • Accepted : 2019.12.28
  • Published : 2019.12.30

Abstract

Stiffness-gradient stretchable electronic packages of the soft PDMS/hard PDMS/FPCB structure were processed using the polydimethylsiloxane (PDMS) as the base substrate and the more stiff flexible printed circuit board (FPCB) as the island substrate. The elastic characteristics of the stretchable packages were estimated and their long-term reliabilities on stretching cycles and bending cycles were characterized. With 0.28 MPa, 1.74 MPa, and 1.85 GPa as the elastic moduli of the soft PDMS, hard PDMS, and FPCB, respectively, the effective elastic modulus of the soft PDMS/hard PDMS/FPCB package was estimated as 0.6 MPa. The resistance of the stretchable packages varied for 2.8~4.3% with stretching cycles ranging at 0~0.3 strain up to 15,000 cycles and for 0.9~1.5% with 15,000 bending cycles at a bending radius of 25 mm.

Acknowledgement

Grant : 형태변형이 가능하고 신체 탈착이 편리한 착용형 디바이스 및 UI/UX 개발

Supported by : 정보통신기술진흥센터

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