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Preparation of Silica-Filled SBR Compounds with Low Rolling Resistance by Wet Masterbatch

  • Received : 2019.11.14
  • Accepted : 2019.12.20
  • Published : 2020.03.31

Abstract

The physical properties of silica-filled SBR compounds (WSBR) prepared using silica-SBR wet masterbatches (WMB) were systematically investigated to understand the effect of the surface treatment of silica on the reinforcement performance of SBR. Treatment of silica with bis(triethoxysilylpropyl)tetrasulfide (TESPT) in the liquid phase, followed by mixing with an SBR solution and recovery by water stripping, easily produced silica-SBR WMB. However, insufficient surface treatment in terms of the amount and stability of the incorporated TESPT led to considerable silica loss and inevitable TESPT elution. Pretreatment of silica in the gas phase with TESPT and another organic material that enabled the formation of organic networks among the silica particles on the surface provided hydrophobated silica, which could be used to produce silica-SBR WMB, in high yields of above 99%. The amount and type of organic material incorporated into silica greatly influenced the cure characteristics, processability, and tensile and dynamic properties of the WSBR compounds. The TESPT and organic material stably incorporated into silica increased their viscosity, while the organic networks dispersed on the silica surface were highly beneficial for reducing their rolling resistance. Excessive dosing of TESTP induced low viscosity and a high modulus. The presence of connection bonds formed by the reaction of glycidyloxy groups with amine groups on the silica surface resulted in physical entanglement of the rubber chains with the bonds in the WSBR compounds, leading to low rolling resistance without sacrificing the mechanical properties. Mixing of the hydrophobated silica with a rubber solution in the liquid phase improved the silica dispersion of WSBR compounds, as confirmed by their low Payne effect, and preservation of the low modulus enhanced the degree of entanglement.

Acknowledgement

Supported by : Korea Evaluation Institute of Industrial Technology (KEIT)

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