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Journal of the Microelectronics and Packaging Society
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Journal Basic Information
pISSN :
1226-9360 
eISSN :
2287-7525 
Journal DOI :
10.6117/kmeps 
Frequency :
Quarterly 
Editor in Chief :
 Aims & Scope
The Journal of the Microelectronics and Packaging Society reports on the microelectronics and packaging technology, while examining technical developments and theoretical studies in microelectronics and advanced packaging field. The journal contains technical papers detailing critical new developments in microelectronics and packaging field, as well as invited and contributed review papers on topic of current interest. It was launched in 1994. Journal of ISHM-Korea, The Microelectronics Society changed Journal of the Microelectronics and Packaging Society in 1998. And year 1998, 1226-489X ISSN Number changed to 1226-9360. Total or a part of the articles in this Journal are abstracted in DOI/Cross ref, Asia Science and Technology Portal and KSCI.
 Publisher Information
The Korean Microelectronics and Packaging Society
 Language
Korean
 Indexed in
KSCI:
 Impact Factor(IF),