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Journal of Manufacturing Technology Engineers
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Journal Basic Information
pISSN :
2508-5093 
eISSN :
2508-5107 
Journal DOI :
10.7735/ksmte 
Frequency :
Others 
Editor in Chief :
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  • Wafer Level Package Design Optimization Using FEM
  • Ko, Hyun-Jun ; Lim, Seung-Yong ; Kim, Hee-Tea ; Kim, Jong-Hyeong ; Kim, Ok-Rae ;
  • Journal of Manufacturing Technology Engineers, volume 23, issue 3, 2014, Pages 230~236
  • DOI : 10.7735/ksmte.2014.23.3.230
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