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REFERENCE LINKING PLATFORM OF KOREA S&T JOURNALS
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Journal of the Korean Society for Precision Engineering
Journal Basic Information
Journal DOI :
Korean Society of Precision Engineering
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Volume & Issues
Volume 27, Issue 12 - Dec 2010
Volume 27, Issue 11 - Nov 2010
Volume 27, Issue 10 - Oct 2010
Volume 27, Issue 9 - Sep 2010
Volume 27, Issue 8 - Aug 2010
Volume 27, Issue 7 - Jul 2010
Volume 27, Issue 6 - Jun 2010
Volume 27, Issue 5 - May 2010
Volume 27, Issue 4 - Apr 2010
Volume 27, Issue 3 - Mar 2010
Volume 27, Issue 2 - Feb 2010
Volume 27, Issue 1 - Jan 2010
Selecting the target year
Development of a Hybrid DPSSL with a Pulse Parameter Variable LD Seed
Noh, Young-Chul ; Shin, Woo-Jin ; Yu, Bong-Ahn ; Lee, Yeung-Lak ; Jung, Chang-Soo ;
Journal of the Korean Society for Precision Engineering, volume 27, issue 10, 2010, Pages 7~13
We report a hybrid DPSSL with a pulse parameter variable LD seed, all-fiberized polarization-maintained pulsed Yb-doped fiber preamplifier chains, and a bulk Nd:
power amplifier. Pulse parameter of LD seed was controlled by direct current modulation. The hybrid DPSSL generates 1064 nm laser pulses with an average power of 40W, a pulse duration of 20-40ns, and a repetition rate of 100-500kHz.
Laser Drilling System for Fabrication of Micro via Hole of PCB
Cho, Kwang-Woo ; Park, Hong-Jin ;
Journal of the Korean Society for Precision Engineering, volume 27, issue 10, 2010, Pages 14~22
The most costly and time-consuming process in the fabrication of today's multi-layer circuit board is drilling interconnection holes between adjacent layers and via holes within a layer. Decreasing size of via holes being demanded and growing number of via holes per panel increase drilling costs. Component density and electronic functionality of today's multi-layer circuit boards can be improved with the introduction of cost-effective, variable depth laser drilled blind micro via holes, and interconnection holes. Laser technology is being quickly adopted into the circuit board industry but can be accelerated with the introduction of a true production laser drilling system. In order to get optimized condition for drilling to FPCB (Flexible Printed Circuit Board), we use various drill pattern as drill step. For productivity, we investigate drill path optimization method. And for the precise drilling the thermal drift of scanner and temperature change of scan system are tested.
Study of Laser Trimming and Cutting of Printed Circuit Board by using UV Laser with Nanosecond Pulse Width
Ryu, Kwang-Hyun ; Shin, Suk-Hoon ; Park, Hyeong-Chan ; Nam, Gi-Jung ; Kwon, Nam-Ic ;
Journal of the Korean Society for Precision Engineering, volume 27, issue 10, 2010, Pages 23~28
Resistance trimming and cutting processes of printed circuit board by making use of high power UV laser with nano-second pulse width have been proposed and investigated experimentally. Also laser-based application system with high flexibility and complex has been designed and adopted power controller, auto beam size control, auto-focusing and control program developed for ourselves. The function of each module shows that they can be reliable for industrial equipments. Resistance trimming method used a plunge and double cut process with
spot size beam. Results show that double cut process is more effective to control resistance trimming in precision than plunge cut process.
A Study on the Computational Analysis of 355nm UV Laser Multiple-Pulsed Micro Machining Considering the Strain Rate Effect
Lee, Jung-Han ; Oh, Jae-Yong ; Park, Sang-Hu ; Nam, Gi-Jung ; Ryu, Gwang-Hyun ; Shin, Suk-Hun ; Shin, Bo-Sung ;
Journal of the Korean Society for Precision Engineering, volume 27, issue 10, 2010, Pages 29~33
UV laser micromachining of metallic materials has been used in microelectronic and other industries. This paper shows on experimental investigation of micromachining of copper using a 355nm UV laser with 50ns pulse duration. A finite element model with high strain rate effect is especially suggested to investigate the phenomena which are only dominated by mechanically pressure impact in disregard of thermally heat transfer. In order to consider the strain rate effect, Cowper-Symonds model was used. To analyze the dynamic deformation during a very short processing time, which is nearly about several tens nanoseconds, a commercial Finite Element Analysis (FEA) code, LS-DYNA 3D, was employed for the computational simulation of the UV laser micro machining behavior for thin copper material. From these computational results, depth of the dent (from one to six pulsed) were observed and compared with previous experimental results. This will help us to understand interaction between UV laser beam and material.
Path Generation Algorithm Development for Ultrafast/Wide Area Laser Processing
Kim, Kyung-Han ; Yoon, Kwang-Ho ; Lee, Jae-Hoon ;
Journal of the Korean Society for Precision Engineering, volume 27, issue 10, 2010, Pages 34~39
We developed a path algorithm for ultrafast/wide area laser processing. Demands for high precision laser processing with a wide area has been increasing for a number of applications such as in solar cell battery, display parts, electronic component and automobile industry. Expansion of the area in which laser processing is an important factor to handle the ultrafast/wide area processing, it will require a processing path. Processing path is path of 2- axis stage and stage of change in velocity can be smooth as possible. In this paper, we proposed a smoothingnurbs method of improved speed profile. This method creates soft path from edge part, it is main purpose that scan area (
) inside processing path makes path of topology of possible straight line. We developed a simulation tool using Visual C++.
Picoseconds Laser Drilling and Platform
Suh, Jeong ; Shin, Dong-Sig ; Sohn, Hyon-Kee ; Song, Jun-Yeob ;
Journal of the Korean Society for Precision Engineering, volume 27, issue 10, 2010, Pages 40~44
Laser drilling is an enabling technology for Through Silicon Via (TSV) interconnect applications. Recent advances in picoseconds laser drilling of blind, micron sized vias in silicon is presented here highlighting some of the attractive features of this approach such as excellent sidewall quality. In this study, we dealt with comparison of heat affection around drilled hole between a picosecond laser and a nanosecond laser process under the UV wavelength. Points which special attention should be paid are that picosecond laser process lowered experimentally recast layer, surface debris and micro-crack around hole in comparison with nanosecond laser process. These finding suggests that laser TSV process has possibility to drill under
via. Finally, the laser drilling platform was constructed successfully.
Improvement of Electrical Discharge Drilling
Song, Ki-Young ; Chung, Do-Kwan ; Park, Min-Soo ; Chu, Chong-Nam ;
Journal of the Korean Society for Precision Engineering, volume 27, issue 10, 2010, Pages 45~51
Electrical discharge drilling (ED-drilling) is a widespread machining method used to bore small holes with a high aspect ratio. This paper presents additional methods by which ED-drilling can improve machining speed, tool wear, and machined surface quality. Firstly, for high machining speed, and low tool wear, a new-type electrode that was ground on one side or both sides of the cylindrical electrodes was suggested to expel debris. The debris which is generated during the machining process can cause sludge deposition and secondary discharge problems: major reasons to decrease machining speed. This new-type electrode also reduced tool wear that was due to the decrease of unstable discharge in a machining gap by helping to expel waste water and debris from the gap. Secondly, to improve the machined surface roughness, an electrolyzation process was included after drilling. This process made the machined surface smooth by means of an electrochemical reaction between an electrode and a workpiece. In this study, the machining speed, electrode wear, and surface roughness were improved by the newtype electrode and the electrolytic process.
Reduction of Relative Position Error for DGPS Based Localization of AUV using LSM and Kalman Filter
Eom, Hyeon-Seob ; Kim, Ji-Yen ; Baek, Jun-Young ; Lee, Min-Cheol ;
Journal of the Korean Society for Precision Engineering, volume 27, issue 10, 2010, Pages 52~60
It is generally important to get a precise position information for autonomous unmanned vehicle(AUV) to run safely. For getting the position of AUV, the GPS has been using to navigation in a vehicle. Though it is useful to finding a position, it is difficult to precisely control a trajectory of the AUV due to large measuring error which may reach over 10 meters. Therefore to apply AUV it needs to compensate for the error. This paper proposes a method to more precisely localize AUV using three low-cost differential global positioning systems (DGPS). The distance errors between each DGPS are minimized as using the least square method (LSM) and the Kalman filter to eliminate a Gaussian white noise. The selected DGPS is cheaper and easier to set up than the RTK-GPS. It is also more precise than the general GPS. The proposed method can compensate the relatively position error according to stationary and moving distance of the AUV. For evaluating the algorithm by simulation, the DGPS signal with the Gaussian white noise to any points is generated by the AR model and compared with the measurement signal. It is confirmed that the proposed method can effectively compensate the position error as comparing with the measurement signal. The compensated position signal can be used to localize and control the AUV in the road.
Development of Force Sensors of Toes and Heel for Humanoid Robot's Intelligent Foot
Kim, Gab-Soon ;
Journal of the Korean Society for Precision Engineering, volume 27, issue 10, 2010, Pages 61~68
In order to let the humanoid robot walk on the uneven terrains, the robot's foot should have the similar structure and function as human's. The intelligent foot should be made up of toes and heel. When it walks on the uneven terrains, the foot's sole senses the force and adjusts foot's position before robot losing his balance. In this paper, the force sensors of robot's intelligent foot for having the similar structure and function like human are developed. The heel 3-axis force/moment sensor and toe force sensors for humanoid robot's intelligent foot is developed, and the characteristic tests of them are carried out. As a result of characteristic test, the interference error of the heel 3-axis force/moment sensor is less than 2.2%. It is thought that the developed force sensors could be used to measure the reaction forces which is applied the toes and the heel of a humanoid robot.
The Evaluation of Fracture Toughness for Woven Carbon Fibered Reinforced Composite Materials
Park, Hong-Sun ; Lee, Woo-Hyung ; Keum, Jin-Hwa ; Choi, Jung-Hun ; Koo, Jae-Mean ; Seok, Chang-Sung ;
Journal of the Korean Society for Precision Engineering, volume 27, issue 10, 2010, Pages 69~76
This study examined how the fracture toughness is affected according to the variation of the initial crack length and the fiber arranged angle using FEA method and experimental method. Therefore, the energy release rates were calculated and compared by J-integral method and VCCT(Virtual Crack Closure Technique). The results of fracture toughness test verified these results. At this time, the locus method was used in order to determine the energy release rate. When the results of FEA were compared with those of experiment, all of those decreased with the increase of angle between load and the fiber arranged direction. The decrease was due to reducing maximum load and stiffness, and the reason of reduction has been judged that the inplane shear stress.
An Experimental Study on the Noise Reduction Method of HEV-relay Module
Seo, Jae-Yong ; Kim, Won-Jin ;
Journal of the Korean Society for Precision Engineering, volume 27, issue 10, 2010, Pages 77~83
In this paper, the noise of HEV(hybrid electric vehicle)-relay module during the turn-on and turnoff switching is experimentally analyzed and an effective method is proposed to reduce the impact noise. First, enclosure methods of 100A relay part with urethane and silicon are tested to find out a better material to isolate the noise. This result shows that the urethane is a better for the noise isolation of relay, so the relays enclosed by urethane are installed in the relay module. Second, the noise of HEV-relay module is analyzed experimentally to identify the noise generation mechanism. From this result, it is found that the vibration transmitted to battery pack through bolt generates the structural borne noise with the frequency band of 200~2000 Hz, which is more serious when the switch is turned off. Finally, the direction of switching and the joint structure are modified in order to isolate the vibration transmitted to battery back. Both methods are very effective to reduce the switching noise.
A Numerical Study on the Internal Flow Characteristics and Pumping Performance of a Piezoelectric-based Micropump with Electromagnetic Resistance
An, Yong-Jun ; Oh, Se-Hong ; Kim, Chang-Nyung ;
Journal of the Korean Society for Precision Engineering, volume 27, issue 10, 2010, Pages 84~92
In this study a numerical analysis has been conducted for the flow characteristics and pumping performance of a piezoelectric-based micropump with electromagnetic resistance exerted on electrically conducting fluid. Here, electromagnetic resistance is alternately applied at the inlet and outlet with alternately applied magnetic fields in association with the reciprocal membrane motion of the piezoelectric-based micropump. A model of Prescribed Deformation is used for the description of the membrane motion. The internal flow characteristics and pumping performance are investigated with the variation of magnetic flux density, tube size, displacement of membrane and the frequency of the membrane. It turns out that the current micropump has a wide range of pumping flow rate compared with diffuser-nozzle based micropumps.
Direct Patterning of 3D Microstructures on an Opaque Substrate Using Nano-Stereolithography
Son, Yong ; Lim, Tae-Woo ; Ha, Cheol-Woo ; Yang, Dong-Yol ; Jung, Byung-Je ; Kong, Hong-Jin ;
Journal of the Korean Society for Precision Engineering, volume 27, issue 10, 2010, Pages 93~99
A nano-stereolithography is the direct patterning process with a nanoscale resolution using twophoton absorption induced by a femtosecond laser. However, in the majority of the works, the fabrication of 3D microstructures have been done only onto transparent glass due to the use of an oil immersion objective lens for achieving a high resolution. In this work, the coaxial illumination and the auto-focusing system are proposed for the direct patterning of nano-precision patterns on an opaque substrate such as a silicon wafer and a metal substrate. Through this work, 3D polymer structures and metallic patterns are fabricated on a silicon wafer using the developed process.