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REFERENCE LINKING PLATFORM OF KOREA S&T JOURNALS
> Journal Vol & Issue
Journal of the Microelectronics and Packaging Society
Journal Basic Information
Journal DOI :
The Korean Microelectronics and Packaging Society
Editor in Chief :
Volume & Issues
Volume 10, Issue 4 - Dec 2003
Volume 10, Issue 3 - Sep 2003
Volume 10, Issue 2 - Jun 2003
Volume 10, Issue 1 - Mar 2003
Selecting the target year
Preparation and Properties of Organic Electroluminescent Devices Using Low Molecule Compounds
Journal of the Microelectronics and Packaging Society, volume 10, issue 1, 2003, Pages 1~5
The multi-layered OELDs(organic electroluminescent devices) were prepared on the patterened ITO (indium tin oxide)/glass substrates by the vacuum thermal evaporation method. The
(tris-(8-hydroxyquinoline)aluminum) low molecule compound was used as the light emission layer. TPD(triphenyl-diamine) and
were used as the hole transport layer. CuPc (Copper phthalocyanine) was also used as the hole injection layers. In addition, QD2 (quinacridone2) organic material with
thickness was deposited in the
emission layer to improve the luminance efficiency. The threshold voltage was about 7V for all devices. The luminance and efficiency of devices was improved by substitution the
for TPD as the hole as the hole transport layer. The luminance efficiency of the OELD sample with QD2 thin film in the
emission layer was found to be 1.55 lm/W, which is about 8 times larger value compared to the sample without QD2 thin layer.
Fabrication of Micro-Heatsink using Nanotemplate
Journal of the Microelectronics and Packaging Society, volume 10, issue 1, 2003, Pages 7~11
The semiconductor chips or electronic components generate heat, which causes malfunction of the parts when it was not cooled properly. Bulky heat sink and cooling fan are used to get rid of the heat. However, with this bulky system, it is hard to integrate the electronics system in a small scale. The cooling efficiency of the system depends on the surface area of the heat sink, thermal conductivity of the material and the method of integration. In order to develop a novel cooling system, a micro-heatsink with a large surface area while retaining small volume was fabricated by electroless deposition of gold/copper inside a Track-etched membrane. The structure of the micro-heatsink was investigated using SEM or optical microscope. It was also found that the micro-heatsink is more efficient than a flat copper plate.
The Improvement Method of Transfer Noise by Power Islands Resonace
Journal of the Microelectronics and Packaging Society, volume 10, issue 1, 2003, Pages 13~18
In this paper, we researched on the improved method for transferring noise which is generated from power island. In general case, the power island has a drawback where the noise transfer increase because of the structural resonance in each power bus. Thus, this paper suggests two improved methods that reduces the noise transfer. First method is to suppress the structural resonance by varying the source of the noise. The second method is to utilize the EGI in order to minimize the EGI in order to minimize the transfer of the noise when the resonance occurs. The simulation analysis shows that the relocation of the noise source dramatically minimized the resonance in power bus and the utilization of EGI has effectively reduced the noise transfer.
A 2012 Size Multilayer LTCC BPE for 2.4 GHz Band
Journal of the Microelectronics and Packaging Society, volume 10, issue 1, 2003, Pages 19~24
A very small size 2.4 GHz ISM band BPF(Band Pass Filter) is realized using LTCC Multi-layer technology. Proposed design method enables to achieve BPF size
resonator with shunt-to-ground loaded capacitor is used to shorten resonator length, achieving higher quality factor. Also this resonator enables BPF to improve out-of-band rejection. Coupling coefficients between coupled strip-line resonators and external quality factor (Qe) of a resonator are derived and applied to the filter design. The measured results show good agreement with simulated data.
Viscoelastic Stress Analysis of Polymeric Thin Layer Under Moisture Absorption
Journal of the Microelectronics and Packaging Society, volume 10, issue 1, 2003, Pages 25~29
This paper deals with the stress singularity induced at the interface corner between the elastic substrate and the viscoelastic thin film as the polymeric film absorbs moisture from the ambient environment. The boundary element method is employed to investigate the behavior of interface stresses. The order of the singularity is obtained numerically for a given viscoelastic model. It is shown that the stress singularity factor is relaxed with time, while the order of the singularity increases with time for the viscoelastic model considered.
Vacuum Packaging of MEMS (Microelectromechanical System) Devices using LTCC (Low Temperature Co-fired Ceramic) Technology
Journal of the Microelectronics and Packaging Society, volume 10, issue 1, 2003, Pages 31~38
In the current electronic technology atmosphere, MEMS (Microelectromechanical System) technology is regarded as one of promising device manufacturing technologies to realize market-demanding device properties. In the packaging of MEMS devices, the packaged structure must maintain hermeticity to protect the devices from a hostile atmosphere during their operations. For such MEMS device vacuum packaging, we introduce the LTCC (Low temperature Cofired Ceramic) packaging technology, in which embedded passive components such as resistors, capacitors and inductors can be realized inside the package. The technology has also the advantages of the shortened length of inner and surface traces, reduced signal delay time due to the multilayer structure and cost reduction by more simplified packaging processes owing to the realization of embedded passives which in turn enhances the electrical performance and increases the reliability of the packages. In this paper, the leakage rate of the LTCC package having several interfaces was measured and the possibility of LTCC technology application to MEMS devices vacuum packaging was investigated and it was verified that improved hermetic sealing can be achieved for various model structures having different types of interfaces (leak rate: stacked via;
/ Torrl/sec, LTCC/AgPd/solder/Cu-tube;
/ Torrl/sec). In real application of the LTCC technology, the technology can be successfully applied to the vacuum packaging of the Infrared Sensor Array and the images of light-up lamp through the sensor way in LTCC package structure was presented.
A Study on the Thermal Behaviour of Via Design in the Ceramic Package
Journal of the Microelectronics and Packaging Society, volume 10, issue 1, 2003, Pages 39~43
Thermal management is very important for the success of high density circuit design in LTCC. In this paper, LTCC substrates containing thermal via and pad were fabricated in order to study the influence of the thermal dissipation. To realize the accurate thermal analysis for structure design, a series of simple thermal conductivity measurement by laser flash method and parametric numerical analysis have been carried out. The LTCC substrate including via and Ag pad has good thermal conductivity over 103 W/mK which is 44% value of pure Ag material. Thermal behaviors with via arrays, size and density in the LTCC substrate were studied by numerical method.
Thermal Cycling Analysis of Flip-Chip BGA Solder Joints
Journal of the Microelectronics and Packaging Society, volume 10, issue 1, 2003, Pages 45~50
Global full 3D finite element analysis fatigue models are constructed for flip-chip BGA on system board to predict the creep fatigue life of solder joints during the thermal cycling test. The fatigue model applied is based on Darveaux's empirical equation approach with non-linear viscoplastic analysis of solder joints. The creep life was estimated the creep life as the variations of the four kinds of thermal cycling test conditions, pad structure, composition and size of solder ball. The shortest fatigue life was obtained at the thermal cycling test condition from
. It was increased about 3.5 times in comparison with that from
. At the same conditions, the fatigue life of SMD structure as the change of pad structure increased about 5.7% as compared with NSMD structure. Consequently, it was confirmed that the fatigue life became short as the creep strain energy density increased in solder joint.
The Microwave Dielectric Properties of MgTiO-CaTiO
Ceramics Dielectrics and Fabrication of GPS Antenna
Journal of the Microelectronics and Packaging Society, volume 10, issue 1, 2003, Pages 51~56
Microwave dielectric properties of the
ceramics were investigated for GPS antenna fabrication. (1-X)
ceramics with X=7 mol% sintered at
exhibited can be dielectric constant of 20.6, the quality factor of 52,500 and the temperature coefficient of resonant frequency of -1.5 [ppm/
]. The results of
/ 0.6 wt% sintered at
exhibited can be dielectric constant of 21, the quality factor of 58,000 and the temperature coefficient of resonant frequency of 2.6 [ppm/
]. The size, insertion loss, center frequency and band width of GPS antenna were
,-10(dB) and 1575.42(MHz) respectively. The insertion loss, center frequency and band width of the fabricated GPS antenna were -11 (dB), 1579(MHz) and 22(MHz) respectively. The center frequency was higher than design result, but other characteristics of GPS antenna were similar to the results of design result.
Sintering and Dielectric Properties of
Microwave Ceramics for LTCC RE module
Journal of the Microelectronics and Packaging Society, volume 10, issue 1, 2003, Pages 57~63
The effects of glass addition on the low-temperature sintering and microwave dielectric properties of
dielectric ceramics were studied. When 10∼13 wt% of lithium borosilicate glass was added, the sintering temperature decreased from 130
relative density of more than 97% was obtained. When the sample was sintered at
with 10 wt% of glass, the dielectric properties of
Magnetic Characteristics of YIG ferrites with Sintering Temperature
Journal of the Microelectronics and Packaging Society, volume 10, issue 1, 2003, Pages 65~69
Microstructural and electromagnetic properties of YIG ferrites, (Y, Ca)-(Fe, V, In, Al)-O for Isolator/Circulator were investigated with the sintering temperature. YIG ferrites of
were fabricated by sintering at
. Crystallographic and microstructural properties were measured using XRD and SEM. Saturation magnetization
were measured using VSM, and FMR(Ferromagnetic Resonance) experiment was conducted to measure ferromagnetic resonance line width
. Microwave characteristics of YIG ferrites were measured using a Network Analyzer. The YIG ferrite of
, sintered at
, showed higher density, saturation magnetization and lower ferromagnetic resonance line width than those sintered at any other temperature.