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REFERENCE LINKING PLATFORM OF KOREA S&T JOURNALS
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Journal of the Microelectronics and Packaging Society
Journal Basic Information
Journal DOI :
The Korean Microelectronics and Packaging Society
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Volume & Issues
Volume 13, Issue 4 - Dec 2006
Volume 13, Issue 3 - Sep 2006
Volume 13, Issue 2 - Jun 2006
Volume 13, Issue 1 - Mar 2006
Selecting the target year
Dominant Migration Element in Electrochemical Migration of Eutectic SnPb Solder Alloy in D. I. Water and NaCl Solutions
Jung, Ja-Young ; Lee, Shin-Bok ; Yoo, Young-Ran ; Kim, Young-Sik ; Joo, Young-Chang ; Park, Young-Bae ;
Journal of the Microelectronics and Packaging Society, volume 13, issue 3, 2006, Pages 1~8
Higher density integration and adoption of new materials in advanced electronic package systems result in severe electrochemical reliability issues in microelectronic packaging due to higher electric field under high temperature and humidity conditions. Under these harsh conditions, metal interconnects respond to applied voltages by electrochemical ionization and conductive filament formation, which leads to short-circuit failure of the electronic package. In this work, in-situ water drop test and evaluation of corrosion characteristics for SnPb solder alloys in D.I. water and NaCl solutions were carried out to understand the fundamental electrochemical migration characteristics and to correlate each other. It was revealed that electrochemical migration behavior of SnPb solder alloys was closely related to the corrosion characteristics, and Pb was primarily ionized in both D.I. water and
solutions. The quality of passive film formed at film surface seems to be critical not only for corrosion resistance but also for ECM resistance of solder alloys.
Characterization of a Micro Power Generator using a Fabricated Electroplated Coil
Lee, Dong-Ho ; Kim, Seong-Il ; Kim, Young-Hwan ; Kim, Yong-Tae ; Park, Min-Chul ; Lee, Chang-Woo ; Baek, Chang-Wook ;
Journal of the Microelectronics and Packaging Society, volume 13, issue 3, 2006, Pages 9~12
We have designed and fabricated micro power generators by electroplating which is important in MEMS(micro electro mechanical system) technique. We have electroplated MEMS coils on the glass substrates and have chosen one of these coils for experiments. The thickness, width, and length of the coil are
, and 1.6 m, respectively. We have analyzed the structure of MEMS coil by SEM. We have made a vibrating system for reproducible results in measurement. With reciprocating a magnet on the surface of a fabricated winding coil, the micro power generator produce an alternating voltage. We have changed the vibrational frequency from 0.5 Hz to 8 Hz. The generated voltage was 106 mV at 3 Hz and 198 mV at 6 Hz. We aim at the micro power generator which can change vibration energy to useful electric energy.
Fabrication of Tungsten Nano Dot by Using Block Copolymer Thin Film
Kang, Gil-Bum ; Kim, Seong-Il ; Kim, Yeung-Hwan ; Park, Min-Chul ; Kim, Yong-Tae ; Lee, Chang-Woo ;
Journal of the Microelectronics and Packaging Society, volume 13, issue 3, 2006, Pages 13~17
Dense and periodic arrays of holes and tungsten none dots were fabricated on silicon oxide and silicon. The holes were approximately 25 nm wide, 40 nm deep, and 60 nm apart. To obtain nano-size patterns, self-assembling resists were used to produce layer of hexagonally ordered parallel cylinders of polymethylmethacrylate(PMMA) in polystyrene(PS) matrix. The PMMA cylinders were degraded and removed with acetic acid rinse to produce a PS mask for pattern transfer. The silicon oxide was removed by fluorine-based reactive ion etching(RIE). Selectively deposited tungsten nano dots were formed inside nano-sized trench by using a low pressure chemical vapor deposition(LPCVD) method. Tungsten nano dot and trenched silicon sizes were 26 nm and 30 nm, respectively.
High Efficiency Power Conversion System of Non Isolated Type Applied in Fuel Cell Generator Used to Fire Prevention Installation
Kwak, Dong-Kurl ;
Journal of the Microelectronics and Packaging Society, volume 13, issue 3, 2006, Pages 19~26
In this paper, author proposes to a fuel cell generation system used to fire prevention installation at emergency. The proposed system is used with a power source of fire prevention installation in preparation for breaking of commercial power supply at emergency. A part of most power loss of the fuel cell generation system is power converter. And the major losses of power converter are switching losses of power semiconductor switches used to power conversion. This parer is designed with a high efficiency power converter of non isolated type in order to increase efficiency of fuel cell power system. The controlling switches used in power conversion system are operated with soft switching, which is applied to partial resonant method to reduce switching loss. The result is that the fuel cell power system gets to high efficiency. Some computer simulated results and experimental results are confirmed to the validity of the analytical results.
A Study on Development of Lightning and Surge Protection System for Electrical Fire Prevention
Kwak, Dong-Kurl ;
Journal of the Microelectronics and Packaging Society, volume 13, issue 3, 2006, Pages 27~32
The occurrence frequency of lightning and surge from the weather accident is increasing recently, which the damage scale have been enlarged every year. A protection system development to solve these problems have been risen to a multinational concern field. In this paper, a novel protection system is proposed to restrain lightning and various surges which happen in electricity and communication equipment. The proposed protection system is designed to the structure to restrain the rise of the earth potential which is become to the problem of conventional protection system. The secondary damage as a result does not happen. The practicality of the developed surge protection system is proved through various accident occurrence simulator.
Lamination of Dielectric Layers by High Pressure Spray Coating for LTCC
Lee, Jee-Hee ; Kim, Young-Jin ;
Journal of the Microelectronics and Packaging Society, volume 13, issue 3, 2006, Pages 33~38
Aerosol slurry composed of dielectric materials, distilled water, and deflocculants was sprayed on the substrates, through a high-pressure spray gun as an aerosol. The coated layers were cofired together with
substrates and green sheets on which the inner connectors were printed. Although the coating rate of coated layers strongly depended on slurry viscosity, spray shape, and the pressure of the spray gun, the coated density was not changed. Buried conductors were maintained as printed by high pressure spray coating method, because the pressing process was not used. At the optimum condition of air controller step 3-4 and slurry viscosity c.p 2000-4000, dense and uniform layers could be achieved. Comparing with conventional lamination process using green sheets, spray coating method enabled thin dielectric layers of
Characteristic of Underfill with Various Epoxy Resin
Noh, Bo-In ; Lee, Jong-Bum ; Jung, Seung-Boo ;
Journal of the Microelectronics and Packaging Society, volume 13, issue 3, 2006, Pages 39~45
This study was investigated the thermal properties of underfill with various epoxy resins using thermal analysis methods such as differential scanning calorimetry (DSC), thermo gravimetry analysis (TGA), dynamic mechanical analysis (DMA) and thermo-mechanical analysis (TMA). And, the adhesion strength of the underfills/FR-4 substrate was evaluated. The glass transition temperature (Tg) of underfill which was composed the cycolaliphatic epoxy resin was lower than that of underfill which was not composed the cycolaliphatic epoxy resin. The thermal degradation of underfill was composed of two processes, which involved chemical reactions between the degrading polymer and oxygen from the air atmosphere. The coefficient of thermal expansion (CTE) of underfill which was composed the cycolaliphatic epoxy resin was higher than that of underfill which was not composed the cycolaliphatic epoxy resin. The excessive curing temperatures caused a weak boundary layer of epoxy resin, which resulted in a deterioration of mechanical properties in the epoxy resin and thus led to poor adhesion property between the underfill/FR-4 substrate.
The Pad Recovery as a function of Diamond Shape on Diamond Disk for Metal CMP
Kim, Kyu-Chae ; Kang, Young-Jae ; Yu, Young-Sam ; Park, Jin-Goo ; Won, Young-Man ; Oh, Kwang-Ho ;
Journal of the Microelectronics and Packaging Society, volume 13, issue 3, 2006, Pages 47~51
Recently, CMP (Chemical Mechanical Polishing) is one of very important processing in semiconductor technology because of large integration and application of design role. CMP is a planarization process of wafer surface using the chemical and mechanical reactions. One of the most important components of the CMP system is the polishing pad. During the CMP process, the pad itself becomes smoother and glazing. Therefore it is necessary to have a pad conditioning process to refresh the pad surface, to remove slurry debris and to supply the fresh slurry on the surface. A conditioning disk is used during the pad conditioning. There are diamonds on the surface of diamond disk to remove slurry debris and to polish pad surface slightly, so density, shape and size of diamond are very important factors. In this study, we characterized diamond disk with 9 kinds of sample.