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REFERENCE LINKING PLATFORM OF KOREA S&T JOURNALS
> Journal Vol & Issue
Journal of the Microelectronics and Packaging Society
Journal Basic Information
Journal DOI :
The Korean Microelectronics and Packaging Society
Editor in Chief :
Volume & Issues
Volume 18, Issue 4 - Dec 2011
Volume 18, Issue 3 - Sep 2011
Volume 18, Issue 2 - Aug 2011
Volume 18, Issue 1 - Mar 2011
Selecting the target year
Development of Knowledge Sharing Platform for Digitization of Surface Mount Technology
Bae, Sung-Min ; Son, Soo-Hyun ; Kwon, Sang-Hyun ; Lee, Hyo-Soo ; Heo, Young-Moo ; Kang, Mun-Jin ; Yoo, Se-Hoon ;
Journal of the Microelectronics and Packaging Society, volume 18, issue 1, 2011, Pages 1~5
In this paper, we introduce knowledge sharing platform for production technology. Surface mount technology (SMT) is one of the important production technologies to fabricate electronic devices. The production technology of the SMT, however, has been propagated from an experienced worker to an inexperienced worker in a manufacturing field. The objective of the knowledge sharing platform is to convert the production experiences like a solder printing knowhow into quantitative values, to construct the database of the process technologies, and to share the technologies systematically via web portal service. In addition, the knowledge sharing platform contains the total production process of mobile products, the information of experts and facilities, and recent R&D output. In this manner, the knowledge sharing platform for production technology could strengthen the technological competitiveness of small and medium manufacturing companies in Korea.
Optical PCB and Packaging Technology
Ryu, Jin-Hwa ; Kim, Dong-Min ; Kim, Eung-Soo ; Jeong, Myung-Yung ;
Journal of the Microelectronics and Packaging Society, volume 18, issue 1, 2011, Pages 7~13
According to increasing of data transfer rate, printed circuit board (PCB) is required improvement of transmission speed. Optical PCB and its packaging technology can be one of the solutions that overcome the limitations of conventional electrical PCB. The data transmission capacity will be increased 10 Tbps at 2015. To this end, studies on various OPCB technologies are being conducted. For cost-effective and high- performance OPCB, studies of optical coupling by polymer replication process are conducted. In this work, optical waveguide and optical fiber array block were sequentially fabricated by polymer pattern replication method. Using this method we successfully demonstrate low loss optical fiber coupling between optical waveguide and optical fiber arrays. And researches on flip chip bonding process and using electro-optic connectors for packaging are conducted.
Evaluation of Flexural Strength of Silicon Die with Thickness by 4 Point Bending Test
Min, Yoon-Ki ; Byeon, Jai-Won ;
Journal of the Microelectronics and Packaging Society, volume 18, issue 1, 2011, Pages 15~21
In this study, flexural strength and fracture behavior of silicon die from single crystalline silicon wafer were investigated as a function of thickness. Silicon wafers with various thickness of 300, 200, 180, 160, 150, and 100
were prepared by mechanical grinding and polishing of as-saw wafers. Flexural strength of 40 silicon dies (size: 62.5 mm
4 mm) from each wafer was measured by four point bending test, respectively. For statistical analysis of flexural strength, shape factor(i.e., Weibull modulus) and scale factor were determined from Weibull plot. Flexural strength reflecting both statistical fracture probability and size (thickness) effect of brittle silicon die was obtained as a linear function of die thickness. Fracture appearance was discussed in relation with measured fracture strength.
Optimization of Electrochemical Etching Parameters in Porous Silicon Layer Transfer Process for Thin Film Solar Cell
Lee, Ju-Young ; Koo, Yeon-Soo ; Lee, Jae-Ho ;
Journal of the Microelectronics and Packaging Society, volume 18, issue 1, 2011, Pages 23~27
Fabrication of porous silicon(PS) double layer by electrochemical etching is the first step in process of ultrathin solar cell using PS layer transfer process. The porosity of the porous silicon layer can be controlled by regulating the formation parameters such as current density and HF concentration. PS layer is fabricated by electrochemical etching in a chemical mixture of HF and ethanol. For electrochemical etching, highly boron doped (100) oriented monocrystalline Si substrates was used. Ths resistivity of silicon is
. The solution composition for electrochemical etching was HF (40%) :
(99 %) :
= 1 : 1 : 2 (by volume). In order to fabricate porous silicon double layer, current density was switched. By switching current density from low to high level, a high-porosity layer was fabricated beneath a low-porosity layer. Etching time affects only the depth of porous silicon layer.
The Effect of Additives on the High Current Density Copper Electroplating
Shim, Jin-Yong ; Moon, Yun-Sung ; Hur, Ki-Su ; Koo, Yeon-Soo ; Lee, Jae-Ho ;
Journal of the Microelectronics and Packaging Society, volume 18, issue 1, 2011, Pages 29~33
The current density in copper electroplating is directly related with the productivity and then to increase the productivity, the increase in current density is required. To obtain the high mass flow rate, rotating disk electrode(RDE) was employed. High rotational speed in RDE can increase the mass flow rate and then high speed electroplating was possible using RDE to control mass flow. Two types of cathode were used. One is RDE and another is rotating cylindrical electrode(RCE). A constant-current, constant-voltage and linear sweep voltammetry were applied to investigate current and voltage relationship. The maximum current density without evolution of hydrogen gas was increased with rotational speed. Over 400 rpm, maximum current density was higher than 1000 A/
. The diffusion coefficients of copper calculated from the slope of the plots are
. The stable voltage without evolution of hydrogen gas was -0.05 V(vs Ag/AgCl). Additives were added to prevent dendritic growth on cathode deposits. The surface roughness was analyzed with UV-Vis Spectrophotometer. The reflectance of the copper surface over 600 nm was measured and was related with the surface roughness. As the surface roughness improved, the reflectance was also increased.
Shearing Characteristics of Sn3.0AgO.5Cu Solder Ball for Standardization of High Speed Shear Test
Jung, Do-Hyun ; Lee, Young-Gon ; Jung, Jae-Pil ;
Journal of the Microelectronics and Packaging Society, volume 18, issue 1, 2011, Pages 35~39
Shearing characteristics of Sn-3.0wt%Ag-0.5wt%Cu ball for standardization of high speed shear test were investigated. The solder ball of 450
in diameter was reflowed at
on FR4 PCB (Printed Circuit Board) to prepare a sample for the high-speed shear test. The metal pads on the PCB were OSP (Organic Solderability Preservative, Cu pad) and ENIG (Electroless Nickel/Immersion Gold, i.e CulNi/Au). Shearing speed was varied from 0.5 to 3.0 m/s, and tip height from 10 to 135
. As experimental results, for the OSP pad, a ductile fracture increased with tip height, and it decreased with shearing speed. In the case of ENIG pad, the ductile fracture increased with the tip height. The tip height of 10
(2% of solder ball diameter) was unsuitable since the fracture mode was mostly pad lift. Shear energy increased with increasing shearing tip height from 10 to 135
for both of OSP and ENIG pads.
Ultra-Wide-Band (UWB) Band-Pass-Filter for Wireless Applications from Silicon Integrated Passive Device (IPD) Technology
Lee, Yong-Taek ; Liu, Kai ; Frye, Robert ; Kim, Hyun-Tai ; Kim, Gwang ; Aho, Billy ;
Journal of the Microelectronics and Packaging Society, volume 18, issue 1, 2011, Pages 41~47
Currently, there is widespread adoption of silicon-based technologies for the implementation of radio frequency (RF) integrated passive devices (IPDs) because of their low-cost, small footprint and high performance. Also, the need for high speed data transmission and reception coupled with the ever increasing demand for mobility in consumer devices has generated a great interest in low cost devices with smaller form-factors. The UWB BPF makes use of lumped IPD technology on a silicon substrate CSMP (Chip Scale Module Package). In this paper, this filter shows 2.0 dB insertion loss and 15 dB return loss from 7.0 GHz to 9.0 GHz. To the best of our knowledge, the UWB band-pass-filter developed in this paper has the smallest size (
) while achieving equivalent electrical performance.
Property Variation of Diamond-like Carbon Thin Film According to the Annealing Temperature
Park, Ch.S. ; Koo, K.H. ; Park, H.H. ;
Journal of the Microelectronics and Packaging Society, volume 18, issue 1, 2011, Pages 49~53
Diamond-like carbon (DLC) films is a metastable form of amorphous carbon containing a significant fraction of Sp3 bond. DLC films have been characterized by a range of attractive mechanical, chemical, tribological, as well as optical and electrical properties. In this study DLC films were prepared by the RF magnetron sputter system on
substrates using graphite target. The effects of the post annealing temperature on the Property variation of the DLC films were examined. The DLC films were annealed at temperatures ranging from 300 to
using rapid thermal process equipment in vacuum. The variation of electrical property and surface morphology as a function of annealing treatment was investigated by using a Hall Effect measurement and atomic force microscopy. Raman and X-ray photoelectron spectroscopy analyses revealed a structural change in the DLC films.
Relationship between Tensile Characteristics and Fatigue Failure by Folding or Bending in Cu Foil on Flexible Substrate
Kim, Byoung-Joon ; Jeong, Myeong-Hyeok ; Hwang, Sung-Hwan ; Lee, Ho-Young ; Lee, Sung-Won ; Cbun, Ki-Do ; Park, Young-Bae ; Joo, Young-Cbang ;
Journal of the Microelectronics and Packaging Society, volume 18, issue 1, 2011, Pages 55~59
Folding endurance, bending fatigue and monotonic tensile tests of 4 kinds of Cu foil on flexible substrate was performed to investigate the relationship between folding or bending endurances and tensile characteristics. The repeated 5.3 or 2.0% strain was applied to Cu foil in folding endurance test or bending fatigue test while monitoring the electrical resistance. Elastic modulus, yield strength, ultimate tensile strength, ductility, and toughness were obtained by monotonic tensile test on the same samples. The Cu foil with higher toughness and ductility showed higher reliabilities in folding or bending fatigue. However, elastic modulus and yield strength did not show any relationship with folding and bending reliability. This is because the failures of Cu foil by folding or bending fatigue were closely related to the fracture energy of metal.