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Journal of the Microelectronics and Packaging Society
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Journal Basic Information
pISSN :
1226-9360 
eISSN :
2287-7525 
Journal DOI :
10.6117/kmeps 
Frequency :
Others 
Editor in Chief :
move
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  • Fabrication and Challenges of Cu-to-Cu Wafer Bonding
  • Kang, Sung-Geun ; Lee, Ji-Eun ; Kim, Eun-Sol ; Lim, Na-Eun ; Kim, Soo-Hyung ; Kim, Sung-Dong ; Kim, Sarah Eun-Kyung ;
  • Journal of the Microelectronics and Packaging Society, volume 19, issue 2, 2012, Pages 29~33
  • DOI : 10.6117/kmeps.2012.19.2.029
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