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Journal of the Microelectronics and Packaging Society
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Journal Basic Information
pISSN :
1226-9360 
eISSN :
2287-7525 
Journal DOI :
10.6117/kmeps 
Frequency :
Others 
Editor in Chief :
move
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6
  • Ti/Cu CMP process for wafer level 3D integration
  • Kim, Eunsol ; Lee, Minjae ; Kim, Sungdong ; Kim, Sarah Eunkyung ;
  • Journal of the Microelectronics and Packaging Society, volume 19, issue 3, 2012, Pages 37~41
  • DOI : 10.6117/kmeps.2012.19.3.037
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12
  • The Study on Chip Surface Treatment for Embedded PCB
  • Jeon, Byung-Sub ; Park, Se-Hoon ; Kim, Young-Ho ; Kim, Jun-Cheol ; Jung, Seung-Boo ;
  • Journal of the Microelectronics and Packaging Society, volume 19, issue 3, 2012, Pages 77~82
  • DOI : 10.6117/kmeps.2012.19.3.077
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