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Journal of the Microelectronics and Packaging Society
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Journal Basic Information
pISSN :
1226-9360 
eISSN :
2287-7525 
Journal DOI :
10.6117/kmeps 
Frequency :
Others 
Editor in Chief :
move
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  • Heat Dissipation Technology of IGBT Module Package
  • Suh, Il-Woong ; Jung, Hoon-Sun ; Lee, Young-Ho ; Kim, Young-Hun ; Choa, Sung-Hoon ;
  • Journal of the Microelectronics and Packaging Society, volume 21, issue 3, 2014, Pages 7~17
  • DOI : 10.6117/kmeps.2014.21.3.007
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3
  • Nanowell Array based Sensor and Its Packaging
  • Lee, JuKyung ; Akira, Tsuda ; Jeong, Myung Yung ; Lee, Hea Yeon ;
  • Journal of the Microelectronics and Packaging Society, volume 21, issue 3, 2014, Pages 19~24
  • DOI : 10.6117/kmeps.2014.21.3.019
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10
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