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Journal of the Microelectronics and Packaging Society
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The Korean Microelectronics and Packaging Society
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Volume & Issues
Volume 23, Issue 2 - Jun 2016
Volume 23, Issue 1 - Mar 2016
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Trends of Researches and Technologies of Electronic Packaging Using Graphene
Ko, Yong-Ho ; Choi, Kyeonggon ; Kim, Sang Woo ; Yu, Dong-Yurl ; Bang, Junghwan ; Kim, Taek-Soo ;
Journal of the Microelectronics and Packaging Society, volume 23, issue 2, 2016, Pages 1~10
DOI : 10.6117/kmeps.2016.23.2.001
This paper reports the trends of researches and technologies of electronic packaging using graphene. Electronic packaging is to provide the signal and electrical current among electronic components, to remove the heat in electronic systems or components, to protect and support the electronic components from external environment. As the required functions and performances of electronic systems or components increase, the electronic packaging has been intensively attracted attention. Therefore, technologies such as miniaturization, high density, Pb-free material, high reliability, heat dissipation and so on, are required in electronic packaging. Recently, graphene, which is a single two-dimensional layer of carbon atoms, has been extensively investigated because of its superior mechanical, electrical and thermal properties. Until now, many studies have been reported the applications using graphene such as flexible display, electrode, super capacitor, composite materials and so on. In this paper, we will introduce and discuss various studies on recent technologies of electronic packaging using graphene for solving the required issues.
Manufacturing Technology for Tape Casting and Soft Magnetic Powder Using by Recycling Scrap of Fe-Si Electrical Sheet
Hong, Won Sik ; Kim, Sang Hyun ; Park, Ji-Yeon ; Oh, Chulmin ; Lee, Woo Sung ; Kim, Seung Gyeom ; Han, Sang Jo ; Shim, Geum Taek ; Kim, Hwi-Jun ;
Journal of the Microelectronics and Packaging Society, volume 23, issue 2, 2016, Pages 11~18
DOI : 10.6117/kmeps.2016.23.2.011
This study focused on examining the possibility for recycling of Fe-Si electric sheet. We manufactured Fe-6.5Si mother alloy using by Fe-Si electric sheet scrap for transformer core materials. And then, soft magnetic alloy powder which diameter and shape were
and sphere type was prepared by gas atomization process. As we compared to commercial Fe-6.5Si powder, its diameter distribution and microstructure of recycled powder was a similar. To investigate the possibility of reusing the soft magnetic composite sheet for electronics, recycled powder was treated to have a high aspect ratio (AR), and we finally obtained the 65~66 AR and
thickness powder. To release the residual stress of powder, heat treatment was conducted under
gas. And then, soft magnetic sheet was made by tape casting process using by those powders. After the density and permeability of tape was measured, and we confirmed that the recycled Fe-Si electric sheet scrap was possible to reuse the soft magnetic materials of electronics.
Measurement Technologies of Mechanical Properties of Polymers used for Flexible and Stretchable Electronic Packaging
Kim, Cheolgyu ; Lee, Tae-Ik ; Kim, Taek-Soo ;
Journal of the Microelectronics and Packaging Society, volume 23, issue 2, 2016, Pages 19~28
DOI : 10.6117/kmeps.2016.23.2.019
This paper presents an overview of selected advanced measurement technologies for the mechanical properties of polymers used for flexible and stretchable electronic packaging. Over the years, a variety of flexible and stretchable electronics have been developed due to their potential applications for next generation IT industry. To achieve more flexible and wearable devices for practical applications, the usage of polymeric components has been increased significantly. Therefore, accurate measurement of mechanical properties of the polymers is necessary in order to design mechanically reliable devices. However, the measurement has been challenging due to the soft nature and thin applications of polymers. Here, we describe novel measurement technologies of mechanical properties of polymers for flexible and stretchable electronics.
Overview on Smart Sensor Technology for Biometrics in IoT Era
Kim, Kwang-Seok ; Kim, Dae Up ;
Journal of the Microelectronics and Packaging Society, volume 23, issue 2, 2016, Pages 29~35
DOI : 10.6117/kmeps.2016.23.2.029
With the pace of rapid innovation in technology of IoT (Internet of Things) and smart devices, biometric technology becomes one of the most progressive industries. Recent trends in biometrics show most are focused on embedding biometric sensors in mobile devices for user authentication. Multifactor biometrics such as fingerprint, retina, voice, etc. are considering as identification system to provide users with services more secured and convenient. Here we, therefore, demonstrate some major technologies and market trends of mobile biometric technology with its concerns and issues.
Reliability Assessment of Low-Power Processor Packages for Supercomputers
Park, Ju-Young ; Kwon, Daeil ; Nam, Dukyun ;
Journal of the Microelectronics and Packaging Society, volume 23, issue 2, 2016, Pages 37~42
DOI : 10.6117/kmeps.2016.23.2.037
While datacenter operation cost increases with electricity price rise, many researchers study low-power processor based supercomputers to reduce power consumption of datacenters. Reliability of low-power processors for supercomputers can be of concern since the reliability of many low-power processors are assessed based on mobile use conditions. This paper assessed the reliability of low-power processor packages based on supercomputer use conditions. Temperature cycling was determined as a critical failure cause of low-power processor packages through literature surveys and failure mode, effect and criticality analysis. The package temperature was measured at multiple processor load conditions to examine the relationship between processor load and package temperature. A physics-of-failure reliability model associated with temperature cycling predicted the expected lifetime of low-power processors to be less than 3 years. Recommendations to improve the lifetime of low-power processors were presented based on the experimental results.
Study on the Properties of TiO
Film Deposited by ALD at Low Temperature
Park, Won Hee ; Shin, Jeong Woo ; Yang, Byung Chan ; Park, Man-Jin ; Jang, Dong Young ; An, Jihwan ;
Journal of the Microelectronics and Packaging Society, volume 23, issue 2, 2016, Pages 43~47
DOI : 10.6117/kmeps.2016.23.2.043
This paper covers the study on the properties of
film deposited by atomic layer deposition (ALD) using TTIP and water at various temperatures including the low temperature range of <
. At low deposition temperature, ALD
films showed uniform growth rate per cycle (
), good uniformity, smooth surface, and homogenous amorphicity. They also showed good conformality of >80% on the trench structure with the high aspect ratio of up to 75. However, relatively high concentration of impurities (C~4-7 at%) in the film was observed due to low deposition temperature.
Effects of Post-annealing and Temperature/Humidity Conditions on the Interfacial Adhesion Energies of ALD RuAlO Diffusion Barrier Layer for Cu Interconnects
Lee, Hyeonchul ; Jeong, Minsu ; Bae, Byung-Hyun ; Cheon, Taehun ; Kim, Soo-Hyun ; Park, Young-Bae ;
Journal of the Microelectronics and Packaging Society, volume 23, issue 2, 2016, Pages 49~55
DOI : 10.6117/kmeps.2016.23.2.049
The effects of post-annealing and temperature/humidity conditions on the interfacial adhesion energies of atomic layer deposited RuAlO diffusion barrier layer for Cu interconnects were systematically investigated. The initial interfacial adhesion energy measured by four-point bending test was
. The interfacial adhesion energy decreased to
after 500 hrs at
/85% T/H condition, while it increased to
after annealing at
for 500 hrs. The X-ray photoemission spectroscopy (XPS) analysis showed that delaminated interface was RuAlO/
for as-bonded and T/H conditions, while it was Cu/RuAlO for post-annealing condition. XPS O1s peak separation results revealed that the effective generation of strong Al-O-Si bonds between
interface at optimum post-annealing conditions is responsible for enhanced interfacial adhesion energies between RuAlO/
interface, which would lead to good electrical and mechanical reliabilities of atomic layer deposited RuAlO diffusion barrier for advanced Cu interconnects.
Electrospun Magnetic Nanofiber as Multifunctional Flexible EMI-Shielding Layer and its Optimization on the Effectiveness
Yu, Jiwoo ; Nam, Dae-Hyun ; Lee, Young-Joo ; Joo, Young-Chang ;
Journal of the Microelectronics and Packaging Society, volume 23, issue 2, 2016, Pages 57~63
DOI : 10.6117/kmeps.2016.23.2.057
We developed a flexible and micro-thick electromagnetic interference (EMI) shielding nanofabric layer that also functions as a water resisting and heat sinking material. Electrospinning followed by a simple heat treatment process was carried on to produce the EMI-shielding Ni/C hybrid nanofibers. The ambient oxygen partial pressure (
= 0.1, 0.7, 1.3 Torr) applied during the heat treatment was varied in order to optimize the effectiveness of EMI-shielding by modifying the size and crystallinity of the magnetic Ni nanoparticles distributed throughout the C nanofibers. Permittivity and permeability of the nanofibers under the electromagnetic (EM) wave frequency range of 300 MHz~1 GHz were measured, which implied the EMI-shielding effectiveness (SE) optimization at
= 0.7 Torr during the heat treatment. The materials' heat diffusivity for both in-plane direction and vertical direction was measured to confirm the anisotropic thermal diffusivity that can effectively deliver and sink the local heat produced during device operations. Also, the nanofibers were aged at room temperature in oxygen ambient for water resisting function.
Development of Energy Harvesting Hybrid system consisted of Electrochromic Device and Dye-Sensitized Solar Cell using Nano Particle Deposition System
Kim, Kwangmin ; Kim, Hyungsub ; Choi, Dahyun ; Lee, Minji ; Park, Yunchan ; Chu, Wonshik ; Chun, Dooman ; Lee, Caroline Sunyong ;
Journal of the Microelectronics and Packaging Society, volume 23, issue 2, 2016, Pages 65~71
DOI : 10.6117/kmeps.2016.23.2.065
In this study, Antimony Tin Oxide (ATO) ion storage layer and
working electrode were fabricated using Nano Particle Deposition System. NPDS is the cutting-edge technology among the dry deposition methods. Accelerated particles are deposited on the substrate through the nozzle using NPDS. The thicknesses for coated layers were measured and layer's morphology was acquired using SEM. The fabricated electrochromic cell's transmittance was measured using UV-Visible spectrometer and power source at 630 nm. As a result, the integrated electrochromic/DSSC hybrid system was successfully fabricated as an energy harvesting system. The fabricated electrochromic cell was self-operated using DSSC as a power source. In conclusion, the electrochromic cell was operated for 500 cycles, with 49% of maximum transmittance change. Also the photovoltaic efficiency for DSSC was measured to be 2.55% while the electrochromic cell on the integrated system had resulted in 26% of maximum transmittance change.
IC Thermal Management Using Microchannel Liquid Cooling Structure with Various Metal Bumps
Won, Yonghyun ; Kim, Sungdong ; Kim, Sarah Eunkyung ;
Journal of the Microelectronics and Packaging Society, volume 23, issue 2, 2016, Pages 73~78
DOI : 10.6117/kmeps.2016.23.2.073
An increase in the transistor density of integrated circuit devices leads to a very high increase in heat dissipation density, which causes a long-term reliability and various thermal problems in microelectronics. In this study, liquid cooling method was investigated using straight microchannels with various metal bumps. Microchannels were fabricated on Si wafer using deep reactive ion etching (DRIE), and Ag, Cu, or Cr/Au/Cu metal bumps were placed on Si wafer by a screen printing method. The surface temperature of liquid cooling structures with various metal bumps was measured by infrared (IR) microscopy. For liquid cooling with Cr/Au/Cu bumps, the surface temperature difference before and after liquid cooling was
and the power density drop was
Control of Position of Neutral Line in Flexible Microelectronic System Under Bending Stress
Seo, Seung-Ho ; Lee, Jae-Hak ; Song, Jun-Yeob ; Lee, Won-Jun ;
Journal of the Microelectronics and Packaging Society, volume 23, issue 2, 2016, Pages 79~84
DOI : 10.6117/kmeps.2016.23.2.079
A flexible electronic device deformed by external force causes the failure of a semiconductor die. Even without failure, the repeated elastic deformation changes carrier mobility in the channel and increases resistivity in the interconnection, which causes malfunction of the integrated circuits. Therefore it is desirable that a semiconductor die be placed on a neutral line where the mechanical stress is zero. In the present study, we investigated the effects of design factors on the position of neutral line by finite element analysis (FEA), and expected the possible failure behavior in a flexible face-down packaging system assuming flip-chip bonding of a silicon die. The thickness and material of the flexible substrate and the thickness of a silicon die were considered as design factors. The thickness of a flexible substrate was the most important factor for controlling the position of the neutral line. A three-dimensional FEA result showed that the von Mises stress higher than yield stress would be applied to copper bumps between a silicon die and a flexible substrate. Finally, we suggested a designing strategy for reducing the stress of a silicon die and copper bumps of a flexible face-down packaging system.
A Study on Fluorescence Imaging System Characteristics depending on Tilting of Band Pass Filter
Kim, Taehoon ; Cho, Sang Uk ; Park, Chan Sik ; Lee, Hak-Guen ; Kim, Doo-In ; Jeong, Myung Yung ;
Journal of the Microelectronics and Packaging Society, volume 23, issue 2, 2016, Pages 85~89
DOI : 10.6117/kmeps.2016.23.2.085
In this paper, we studied effects of tilting angle of band pass filter on the characteristics of fluorescence imaging system. Theoretical modeling showed that transmittance and filtering range are highly dependent on the tilting angle. Measurements on transmittance as a function of wavelength confirmed that changes in transmittance and the band filter range are in good agreement with theoretical prediction. Therefore, characteristics of band pass filter can be precisely tuned by altering tilting angle of band pass filter in order to enhance fluorescence signal in bio imaging system.
Effects of Demolding Temperature on Formability and Optical Properties of Anti-reflective Nanostructure
Yeo, N.E. ; Shim, Y.B. ; Cho, S.U. ; Kim, D.I. ; Kim, K.N. ; Jang, K.S. ; Jeong, M.Y. ;
Journal of the Microelectronics and Packaging Society, volume 23, issue 2, 2016, Pages 91~96
DOI : 10.6117/kmeps.2016.23.2.091
In this study, effects of demolding temperature (DT) on the formability and optical properties were evaluated in order to optimize thermal nanoimprint lithography for anti-reflective film. Characterization on optical property showed that optical performance was gradually enhanced as the DT increased up to
while the transmittance and the reflectance was degraded as the DT increased further to
. In addition, similar behavior was observed from formability analysis. It was contributed to the formation of free volume and viscose flow. Therefore, it was concluded that the formability and optical property are highly influenced by the formation of free volume and viscous flow of polymer depending on the DT.
Effects of Different Pretreatment Methods and Amounts of Reductant on Preparation of Silver-coated Copper Flakes Using Electroless Plating
Oh, Sang Joo ; Kim, Ji Hwan ; Lee, Jong-Hyun ;
Journal of the Microelectronics and Packaging Society, volume 23, issue 2, 2016, Pages 97~104
DOI : 10.6117/kmeps.2016.23.2.097
In the preparation of Ag-coated Cu flakes using L-ascorbic acid as a reductant for the electroless Ag plating, the effects of pretreatment methods and the reductant concentration on the uniformity of Ag coating layer and the anti-oxidation property of Ag-coated Cu flakes during the heating in air were evaluated. It was found that the removal degree of surface oxide layer during the pretreatment has great influence on the uniformity of Ag coating layer and the formation degree of hole defects in the flakes has slight effect on the anti-oxidation property of Ag-coated Cu flakes. It was also verified that the reductant concentration has great influence on the coverage uniformity and thickness of Ag coating, thus it was could be considered a main process parameter. When the reductant concentration was 0.04 M, high-quality Ag-coated Cu flakes was obtained. When the concentration increased to 0.06 M, however, the anti-oxidation property of Ag-coated Cu flakes became remarkably worse owing to remnant of Cu surface non-coated with Ag by the formation of pure Ag fine particles.