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Journal of the Microelectronics and Packaging Society
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Journal Basic Information
pISSN :
1226-9360 
eISSN :
2287-7525 
Journal DOI :
10.6117/kmeps 
Frequency :
Others 
Editor in Chief :
move
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  • Cu Thick film Materials
  • ; ;
  • Journal of the Microelectronics and Packaging Society, volume 3, issue 1, 1996, Pages 1~10
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