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Journal of the Microelectronics and Packaging Society
Journal Basic Information
pISSN :
1226-9360
eISSN :
2287-7525
Journal DOI :
10.6117/kmeps
Frequency :
Others
Publisher:
The Korean Microelectronics and Packaging Society
Editor in Chief :
Seung-Boo Jung
Volume & Issues
Volume 3, Issue 2 - Dec 1996
Volume 3, Issue 1 - Jun 1996
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1
Cu Thick film Materials
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Journal of the Microelectronics and Packaging Society, volume 3, issue 1, 1996, Pages 1~10
Abstract
2
Improving the Wettability of Polymeric Surfaces and Surface Modification of Ceramic by Ion Beam in Reactive gases Environments
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Journal of the Microelectronics and Packaging Society, volume 3, issue 1, 1996, Pages 11~24
Abstract
3
The Sintering Behavior of Ba(Cu, Mo)O3 Flux Added (Ba, Sr)TiO3 Ceramic Dielectrics
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Journal of the Microelectronics and Packaging Society, volume 3, issue 1, 1996, Pages 25~32
Abstract
4
A Study on BST Thin Films by MOD Process
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Journal of the Microelectronics and Packaging Society, volume 3, issue 1, 1996, Pages 33~40
Abstract
5
The Behaviour of Ru Based Thick Film Resistor as a Component of LCR Network
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Journal of the Microelectronics and Packaging Society, volume 3, issue 1, 1996, Pages 41~48
Abstract
6
Low Temperature Fireable Borosilicate/Si3N4 Microcomposite Substrates
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Journal of the Microelectronics and Packaging Society, volume 3, issue 1, 1996, Pages 49~56
Abstract
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