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REFERENCE LINKING PLATFORM OF KOREA S&T JOURNALS
> Journal Vol & Issue
Journal of the Microelectronics and Packaging Society
Journal Basic Information
Journal DOI :
The Korean Microelectronics and Packaging Society
Editor in Chief :
Volume & Issues
Volume 7, Issue 4 - Nov 2000
Volume 7, Issue 3 - Sep 2000
Volume 7, Issue 2 - Jun 2000
Volume 7, Issue 1 - Mar 2000
Selecting the target year
A Study on the Mask Fabrication Process for X-ray Lithography
Journal of the Microelectronics and Packaging Society, volume 7, issue 2, 2000, Pages 1~6
X-ray lithography mask with SiC membrane and Ta absorber patterns has been fabricated using ECR plasma CVD, d.c. magnetron sputtering, and ECR plasma etching. The stress of stoichiometric SiC film was adjusted by rapid thermal annealing under
, ambient. Adjusting the working pressure during sputtering process resulted in a near-zero residual stress, reasonable density, and smooth surface morphology of Ta film. Cl-based plasma showed a good etching characteristics of Ta, and two-step etching process was implemented to suppress microloading effect fur sub-quarter
Failure Paths Analyses of the Leadframe/EMC System
Lee, H.Y. ; Kim, S.R. ;
Journal of the Microelectronics and Packaging Society, volume 7, issue 2, 2000, Pages 7~12
Copper-based leadframe sheets were oxidized in a black-oxide forming solution, and molded with epoxy molding compound (EMC) to form sandwiched double-cantilever beam (SDCB) specimens. The adhesion strength of leadframe/EMC interface was measured in terms of fracture toughness by using SDCB specimens and the fracture surfaces were analyzed by various equipments such as glancing-angle XRD, AFM, and SEM. Results showed that three types of failure paths, which were closely related to the surface condition of leadframes before molding.
Effect of Cu Containing Solders on Shear Strength of As-soldered BGA Solder Joints
Journal of the Microelectronics and Packaging Society, volume 7, issue 2, 2000, Pages 13~19
Shear strengths of BGA solder joints on Cu pads were studied for Cu-containing Sn (0, 1.5, and 2.5 wt.% Cu) and Sn-40Pb (0 and 0.5wt.% Cu) solders, with emphasis on the roles of the Cu-Sn intermetallic layer thickness and the roughness of the interface between the intermetalic layer and solder. The shear strength test was performed for as-soldered solder joints with various soldering reaction times up to 4 min. The addition of Cu to the pure Sn solder results in an enhanced growth of the intermetallic layer whereas the effect of Cu addition to the Sn-40Pb solder is primarily on the reduction of the roughness of the intermetallic/solder interface. The critical thickness of the intermetallic layer for a maximum shear strength depends on the solder materials, which was measured to be ~ 2.3
for Sn-Cu solders and ~ 1.2
for Sn-Pb-Cu solders. The shear strength at the critical intermetallic layer thickness seems to increase as the intermetallic/solder interface becomes rougher. This is in accordance with the observation that the sheared fracture occurred initially within the solder tends to shift towards the intermetallic/solder interface as the intermetallic layer grows above the critical thickness.
Flow Properties of Liquid Epoxy Compounds as a Function of Filler Fraction for the Underfill
Journal of the Microelectronics and Packaging Society, volume 7, issue 2, 2000, Pages 21~27
To develop the underfill materials which are required for the new process of semi-conductor industry, the properties of epoxy/anhydride/cobalt(II) catalyst system with two types of fused silica(1
) are studied as a function of filler fraction. According to the curing profile, the optimum catalyst amount was 1.0 wt% for full curing at the conditions of
/l5 min., and we could conclude that the viscosity has superior effect on the real flaw through the relationship between surface tension and viscosity data. The underfills which were filled with 1
fused silica did not show good flowability, but they should be useful by improving the viscosity for a future process which has small gaps. The underfills which were filled with 8
fused silica showed good flowability when the filler contents were 55~60 vol%. The model which was referred by Matthew can predict the real flow length only when the underfill has high viscosity and low surface tension.
The Effects of Additives and Fabrication Methods on Durability in Acid of Glass Frit for Thick Film Paste
Journal of the Microelectronics and Packaging Society, volume 7, issue 2, 2000, Pages 29~36
The effects of additives and fabrication methods of glass frits far thick film paste on durability in acid of glass frits fur thick film paste were studied. To investigate the effect of fabrication method, glass brit based on
was prepared by various mixing method and number of melting. The effects of addition of
in glass on the durability in acid solution were investigated.
Comparative Study of Texture of Al/Ti Thin Films Deposited on Low Dielectric Polymer and SiO
Journal of the Microelectronics and Packaging Society, volume 7, issue 2, 2000, Pages 37~42
The comparative study of texture of Al/Ti thin films deposited on low-dielectric polymer and
substrates has been investigated. Fifty-nm-thick Ti films and 500-nm-thick Al-1%Si-0.5%Cu (wt%) films were deposited sequentially onto low-k polymers and
by using a DC magnetron sputtering system. The texture of Al thin film was determined using X-ray diffraction (XRD) theta-2theta (
) and rocking curve and the microstructure of Al/Ti films on low-k polymer and
substrates was characterized by cross-sectional transmission electron microscopy (TEM). Both the
method and rocking curve measurement suggest that Al/Ti thin films deposited on
have stronger texture than those deposited on low-k polymer. The texture of Al thin films strongly depended on that of Ti films. Cross-sectional TEM revealed that grains of Ti films on
substrates had grown perpendicular to the substrate, while the grains of Ti alms on SiLK substrates were formed randomly. The lower degree of (111) texture of Al thin films on low-k polymer was due to Ti underlayer.
Crystallization in Li
Glass induced by 355 nm Nd:YAG Laser Irradiation
Lee, Yong-Su ; Kang, Won-Ho ;
Journal of the Microelectronics and Packaging Society, volume 7, issue 2, 2000, Pages 43~46
Nd:YAG laser of 355 nm wavelength, which amounts to 3.5 eV, produced by a harmonic generator was used to create Ag metallic particles as seeds for nucleation in photosensitive glass containing
. The pulse widths and frequency of the laser were 8ns and 10 Hz, respectively. For crystalline growth, heat-treatment following laser irradiation was carried out at
for 1h. Then, the
crystal phase appeared in the laser irradiated lithium aluminum silicate glass. We present the effect of laser-induced nucleation compared with spontaneous nucleation by heat treatment fur crystallization in the glass.
The Fluxless Wetting Properties of TSM-coated Glass Substrate to the Pb-free Solders
Journal of the Microelectronics and Packaging Society, volume 7, issue 2, 2000, Pages 47~53
The fluxless wetting properties of TSM-coated glass substrate were evaluated by the wetting balance method. We could estimate the wettability of the TSM with new parameters obtained from the wetting balance test for one side-coated specimen. It was more effective in wetting to use Cu as a wetting layer and Au as a protection layer than to use Au itself as a wetting layer. The SnSb solder showed better wettability than SnAg, SnBi, and SnIn solders. The contact angle of the one side-coated glass substrate to the Pb-free solders could be calculated from the farce balance equation by measuring the static force and the tilt angle.
A Study on the Wetting Properties of UBM-coated Si-wafer
Journal of the Microelectronics and Packaging Society, volume 7, issue 2, 2000, Pages 55~62
The wetting balance test was performed in an attempt to estimate the wetting properties of the UBM-coated Si-wafer on one side to the Sn-Pb solder. The wetting curves of the one and both side-coated UBM layers had the similar shape and the parameters characterizing the curve shape showed the similar transition tendency to the temperature. The wetting property estimation was possible with the new wettability indices from the wetting curves of one side-coated specimen;
. For UBM of Si-chip, Au/Cu/Cr UBM was better than Au/Ni/Ti in the point of wetting time. The contact angle of the one side coated Si-plate to the Sn-Pb solder could be calculated from the force balance equation by measuring the static state force and the tilt angle.
Study on the Soldering of Off-eutectic Pb-Sn Solders in Partial Melting State
Park, Jae-Yong ; Ha, Jun-Seok ; Kang, Choon-Sik ; Shin, Kyu-Sik ; Kim, Moon-Il ; Jung, Jae-Pil ;
Journal of the Microelectronics and Packaging Society, volume 7, issue 2, 2000, Pages 63~68
This paper introduces the partial melting process for solder application and characterization of its possibility using off-eutectic Pb-Sn alloy. In order to show that the liquid phase in the semi-liquid state maintains the wettability as the single-phase liquid, the wetting balance test are conducted with varying temperatures and compositions. The results are then compared with the surface tension of liquid, both measured and calculated, to examine the correlation. The results from this investigation indicate that the partial melting can yield satisfactory solder joints as long as the liquid phase acquires sufficient chemical activity. At a condition where the partial melting is effective, a direct correlation between the wettability and the surface tension is found to exist. All alloys are found to show a reasonable wettability in semi-liquid state.