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REFERENCE LINKING PLATFORM OF KOREA S&T JOURNALS
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Journal of the Microelectronics and Packaging Society
Journal Basic Information
Journal DOI :
The Korean Microelectronics and Packaging Society
Editor in Chief :
Volume & Issues
Volume 8, Issue 4 - Dec 2001
Volume 8, Issue 3 - Sep 2001
Volume 8, Issue 2 - Jun 2001
Volume 8, Issue 1 - Mar 2001
Selecting the target year
The Oxidation of Kovar in Humidified
Journal of the Microelectronics and Packaging Society, volume 8, issue 2, 2001, Pages 1~7
In order to form a uniform oxidation layer of spinel phase on Kovar which helps the strong bonding in Kovar-to-glass sealing, the humidified
was used as an oxidation atmosphere. The oxidation of Kovar was controlled by diffusion mechanism and the activation energy was 31.61 kacl/mol at 500~
. After oxidation at
, the external oxidation layer was below 0.5
thick. According to TEM analysis, oxidized Kovar was spinel its lattice parameter of 7.9
. Oxidation of under
and in a humidified
atmosphere, Kovar was found to be appropriate for the Kovar-to-glass sealing.
Low-temperature Sintering and Microwave Properties in (Ba
Journal of the Microelectronics and Packaging Society, volume 8, issue 2, 2001, Pages 9~13
The effects of glass addition on the densification and the microwave properties of
dielectric system were studied. When 2~3 wt% of borosilicate glass were added, the density increased and the better microwave properties were obtained. When a sample was sintered at
with 3 wt% of glass, the quality factor and the temperature coefficient of the resonant frequency of the specimen were 4500 and +10
, respectively. The dielectric constant, however, decreased from 90 to 75 with glass addition.
Study on the Evaluation for the Property of Mo-Si Multilayers
Journal of the Microelectronics and Packaging Society, volume 8, issue 2, 2001, Pages 15~18
The Mo/si multilayer for EUV lithography was deposited using magnetron sputtering system. The multilayers were characterized using the cross-sectional transmission electron microscope (TEM) and low/high angle X-ray diffraction (XRD). The microstructure of Mo and Si was highly textured structure and amorphous, respectively. The well-defined low angle XRD peaks implies a well-defined multilayer structure. The interfacial layer of Mo-on-Si was thicker than Si-on-Mo interfacial layer.
optical Simulation on EUV Reflectivity of Mo/Si Multilayer Structure
Journal of the Microelectronics and Packaging Society, volume 8, issue 2, 2001, Pages 19~24
The effect of thickness variation and inter-diffusion layer on the reflectivity of Mo/Si multilayer has been investigated. The reflectivity of the imperfect Mo/Si multilayer with thickness variation of 28% was found to be lowered by 10.8% compared to that of ideal Mo/Si multilayers with 40-periods. When the inter-diffusion layer is taken into account, the reflectivity is decreased by 4.7% additionally. We also fecund that the reflectivity continued to increase until the 25th-layer but it showed irregular tendencies about increment and decrement from the 26th-layer of Mo/Si multilayer structures.
The Effect of the Surface-modified Carbon Anode on the Electrochemical Performance in Li-ion Battery
Journal of the Microelectronics and Packaging Society, volume 8, issue 2, 2001, Pages 25~29
This study examined the effects of carbon surface modification by the epoxy resin coating on the electrochemical performance. The mesocarbon microbeads(MCMB) carbon was surface-modified by coating the epoxy resin and its electrochemical properties as an anode was examined. The surface coating of MCMB was carried out by refluxing the MCMB powders in a dilute H2SO4 solution, and mixing them with the epoxy resin-dissolved tetrahydrofuran(THF) solution. Under heat-treatment of the coated MCMB at the temperature over
, the epoxy-resin coating layer was converted into amorphous phase which was identified by a high resolution transmission electron microscope (HRTEM). The epoxy resin coated MCMB has higher Brunauer-Emmett-Teller (BET) surface area, higher charge/ discharge capacity and better cycleability than a raw MCMB without coating. The reason for the enhancement of cell performance by the epoxy resin coating were considered as the epoxy resin coating layer plays an important role to be a barrier for carbon reacting with electrolyte and to retard the formation of passivation layer.
Characterization of Fluorocarbon Thin Films deposited by PECVD
Journal of the Microelectronics and Packaging Society, volume 8, issue 2, 2001, Pages 31~36
Teflon-like fluorocarbon thin film was deposited by using difluoromethane
) added with Ar,
, TEOS, and Al substrate. The deposited thin film was characterized by static contact angles for measuring hydrophobicity in various additive gas ratio. temperature, and working pressure. In case of addition with Ar, the static contact angles decreased as additive gas ratio and power increased. But the static contact angles increased as working pressure increased. Specially, super-hydrophobic surface was obtained using the powder-like fluorocarbon thin film above 2 Torr. Added with
, the static contact angles decreased as the
ratio and working pressure increased. And the static contact angles did not change in 100W, but hydrophilic surface was obtained at 200W. In case of addition of CE
, static contact angles dramatically increased in
ratio 5. And continuous static contact angles obtained above ratio 5. As compare with previous experiments by thermal evaporation, the fluorocarbon thin film by plasma polymerization was obtained very low hysteresis. This results shows more homogenous surface by plasma polymerization than thermal evaporation process.
BGA to CSP to Flip Chip-Manufacturing Issues
Caswell, Greg ; Partridge, Julian ;
Journal of the Microelectronics and Packaging Society, volume 8, issue 2, 2001, Pages 37~42
The BGA package has been the area array package of choice for several years. Recently, the transition has been to finer pitch configurations called Chip Scale Packages (CSP). Several of these package types are available at 0.5 mm pitch. requiring surface mount assemblers to evaluate and optimize various elements of the assembly process. This presentation describes the issues associated with making the transition from BGA to CSP assembly. Areas addressed will include the accuracy of pick and place equipment, printed wiring board lines and spaces, PWB vias, in-circuit test issues, solder paste printing, moisture related factors, rework and reliability. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. At this pitch, ball and board pad diameters can be as small as 0.25 mm and 0.20 mm respectively. Drilled interstitial vias are no longer possible and higher ball count packages require micro-via board technology. The transition to CSP requires careful evaluation of these issues. Normal paste registration and BGA component tolerances can no longer achieve the required process levels and higher accuracy pick and place machines need to be implemented. This presentation will examine the optimization of these critical assembly operations, contrast the challenges at 0.5 mm and also look at the continuation of the process to incorporate smaller pitch flip chip devices.
The New Thick-Film Hybrid Converters For Halogen and Fluorescent Lamps
Gondek, J. ; Dzialek, K. ; Kocol, J. ; Kawa, B. ;
Journal of the Microelectronics and Packaging Society, volume 8, issue 2, 2001, Pages 43~48
Economical consumption of energy, longer life of lamps, higher lighting comfort and new aesthetic of illumination is subject of numerous research and development works. The halogen lamps are an example of positive solution some of above mentioned problems. The electronic transformers are more frequent used for their supply. In comparison with conventional transformers they have less weight, less volume and 60% less power losses. Their advantages are particular visible, when the hybrid technique is applied. The paper presents the results of engineering research and development works carried out in Private Institute of Electronic Engineering, in R. & D. Center for Hybrid Microelectronics and Resistors and in Technical School of Communications in Krakow, in the field of the design and exploitation tests of hybrid converters 220V AC /12V DC (electronic transformers) and electronic ballasts destined for the supply of halogen lamps 20W to 150W and fluorescent lamps respectively. To perform the converters, thick film technology and surface mount technology were used. For the protection of converter electronic circuit the thick film temperature sensor and transistors were applied. Moreover the paper presents the base application circuits of elaborated converters, their technical parameters and exploitation results. The development perspectives of such domain of hybrid circuits are also discussed.
Multi-Chip Packaging for Mobile Telephony
Bauer, Charles E. ;
Journal of the Microelectronics and Packaging Society, volume 8, issue 2, 2001, Pages 49~52
This paper presents product level considerations for multichip packaging as a cost effective alternative to single chip packaging in the design and manufacture of mobile telephony products. Important aspects include component functionality and complexity, acquisition and logistics costs, product modularity and integration. Multichip packaging offers unique solutions and significant system level cost savings in many applications including RF modules, digital matrix functions and product options such as security, data storage, voice recognition, etc.