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REFERENCE LINKING PLATFORM OF KOREA S&T JOURNALS
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Journal of the Korean institute of surface engineering
Journal Basic Information
Journal DOI :
The Korean Institute of Surface Engineering
Editor in Chief :
Volume & Issues
Volume 22, Issue 4 - Dec 1989
Volume 22, Issue 3 - Sep 1989
Volume 22, Issue 2 - Jun 1989
Volume 22, Issue 1 - Mar 1989
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A Study of the Electroless Ni-W-B Depsition on Alumina Ceramics
Journal of the Korean institute of surface engineering, volume 22, issue 4, 1989, Pages 161~167
Effects of bath composition on electroless deposition of Ni-W-B from sulphate solution were invesrigated in terms of deposition kinetics, electro resistivity and composition of deposit film. The microstruigated and crystataine structure of the films were also studied using a scanning electron microscope and X-ray diffractometer. The deposition rate increased linearly with increasing the concentration of nickel sulphate in bath solution, wheras the rate decreasing with sodium citrate. The rate was also affected by sodium tungstate, which was maaximum at the concentration of 0.06 M/1 in sodium tungstate, The content of W in the deposit increased with increased with increasing the sodium citrate had on opposite effect on the composition of W and B in the deposit. The crystal change film from armorphous to cryatallicne nature by heat treatments was proved by the reduction of specific resistance and X-ray diffration.
Composition and Microstrure of Pb-Sn Alloy Electrodeposit
Journal of the Korean institute of surface engineering, volume 22, issue 4, 1989, Pages 168~178
The compositions and microstructures of Pb-Sn alloy electrodeposits were investigated in terms of the electrolysis conditions conditions by using fluoborate bath. The Pb content of alloy deposit decreased with increasing dreasing current density until the limting content was obtained. The proferred orientation of Pb-phase in the alloy changed in the sequence of (110)longrightarrow(100)longrightarrow(100)+(110)(311)longrightarrowrandom distribution of crystals with increasing cathode overpotential, while that of
-Sn phase was (110)(301)(211)n mixed texture. The smooth surface with granular crystallites was obtained below medium current desity, while the rough surface texture was formed at high current density.
The Effect of Additive Elements on the Formation of Oxide Skins of AI-10wt.% Si Alloy Melts
Journal of the Korean institute of surface engineering, volume 22, issue 4, 1989, Pages 179~184
This study seeks to the morphological changes in the oxide skin of the Al-10wt.%si alloy melts. These changes depend on the oxidation time and the temperature of the molten alloy, as well as the effects of adding Mg, Cu and Ni. Thess affects observed by X-ray diffractometer(XRD) and scanning electron microscope(SEM)' Very litte oxide skins on Al-10wtwt.%Si alloy melts can be detected by XRD because it is less than the measuring capabillity of the XRD, or the formation of noncrystalline oxide skins oxide skins canbe deteced by SEM. The addition of 1%Mg and 1%Cu-1%Mg-2.5%Ni to this base alloy crystallized the structure of the oxide skins and increased the oxidation in proportion to the length of time, but adding 3% had hardiy anyaffect at all on the crystal structure of the oxide skins.
Surface Modification of a Mild and Stainless Steel by Alumina Spraying
Journal of the Korean institute of surface engineering, volume 22, issue 4, 1989, Pages 185~196
The surface modification of a mild and stainless steel by alumina sprayed coating were studied. The effects of surface roughness and bond coating layer on the adhesive strengthy and durability of sprayed specimens were also investiated. The adhesive strength of ceramic coating was affected by surface roughness and bond coating layer thinkness. That showed excellent undergrit blast time and bond coating layer; 60 sec and 0.15-0.33mm, respectively. The adhesive strength and densification of sprayed coating with air pressure were superior to those of without and fracture was mainly occured at alumina-bond coating interface. Under ambient atmosphere at
, the oxides existed within bond coating layer promote diffusion of oxygen to lower durability of sprayed specimens. In this case, fracure was occured at sudstrate-bond coating interface.
The Change of Composition and the Throwing Power of Pb-Sn Alloy Electrodeposits in Pulse Plating
Journal of the Korean institute of surface engineering, volume 22, issue 4, 1989, Pages 197~206
The Composition and throwing power-of Pb-Sn alloy deposits are investigated in tems of the pulse parameters in pulse plating. Microhardness and intermal srress of alloy deposots are measured. The current efficiency of pulse plating is lower than that of D.C.plating while cathode overpotential and macro-throwing power noticebly increase with increasing peak current density. The Pb content of P.C. plated alloy deposits with increasing average current density, is relatively lower than of D.C. plated deposits at the same average current density. The internal stress of Pb-Sn alloy is not detected and the microhardness are 9.0kg/mm2 and 11kg/mm2 for D.C. plated P.C. plated deposits, respectively.
The Microstructure and the Prerred Orientation of Pb-Sn-Alloy Electrodeposits in Pulse Plating
Journal of the Korean institute of surface engineering, volume 22, issue 4, 1989, Pages 207~214
The surface morphology and the proferred orientation of the Pb-Sn alloy electrodeposite were investated by the change of electrolysis conditions in pulse current electroplating. The preferred orientation of Pb-phase in alloy deposits was changed in the sequence of (110)longrightarrow(100)or(100)+(111)longrightarrow(111) with increasing peak current density, while that of
-Sn phase changed from (321)+(301)to(301)+(111) mixed orientation. The surface morphology was closely related to the preferred orientation of alloy electrodeposits. The alloy deposits, which had (100)or(111) for pb-phase and (321)or(100)(301)for
-Sn sespectively, showed the surface structure of granular crystallites. The alloy deposits whih mixed orientations for both phases had microstructure of closely the closely stacked crysrallites, which was inclined to the surface.
A Study on the Electrical Properties of Plasma Silicon Nitride
Journal of the Korean institute of surface engineering, volume 22, issue 4, 1989, Pages 215~220
Silicon Nitride whose thickness is about
by the ellipsometer was successfully formed by the Plasma reaction. Nitrogen Plasma was formed by applying the 200KHz, 500Watt power between the two electroes and nitridation of silicon was carried out directly on the top of the silicon wafer. Thus Silicon Nitride formed was oxidized to from oxynitrides and their electrical characterlstice were analyzed by measuring I-V curves and capacitances. Through ESCA depth profiles, the chemical composition changes before and after the oxidation wers analyzed.