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REFERENCE LINKING PLATFORM OF KOREA S&T JOURNALS
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Journal of the Korean institute of surface engineering
Journal Basic Information
Journal DOI :
The Korean Institute of Surface Engineering
Editor in Chief :
Volume & Issues
Volume 24, Issue 4 - Dec 1991
Volume 24, Issue 3 - Nov 1991
Volume 24, Issue 2 - Jun 1991
Volume 24, Issue 1 - Mar 1991
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SUPERCONDUCTING TAPE BY VAPOR DEPOSITION TECHNIQUES
Maeda, Hiroshi ;
Journal of the Korean institute of surface engineering, volume 24, issue 2, 1991, Pages 67~72
The feasibility of preparing superconducting
films on metallic substrate was exmined in an attempt to fabricate a tape conductor. Deposition methods employed were sputtering, laser ablation, and plasma flash evaporation. Although zero resistance temperature (Tc) is achieved above 90 K, critical current density values (Jc) obtained so far is still low as compared with those reported in the films grown on single crystal substrates. This may be caused by the misalignment of the crystal structure of the films on metal substrates. A further improvement if Jc for highly-oriented polycrystalling films is being investigated at the present time.
A Study on the Formation of Interface and the Thin Film Microstructure in TiN Deposited by Ion Plating
Journal of the Korean institute of surface engineering, volume 24, issue 2, 1991, Pages 73~79
Recent studies son surface coatings have shown that the change of physical, chemical and crystallographic structure analysed and observed according to the deposition process variables has the effects on the resultant film properties. Under the same preparation condition conditions of the substrate and process variables, physical morphology variations characterized by substrate temperature and bias which offect the surface mobility of adatom and adhesion variations related to the formation of Ti interlayer were considered in the present study. Microhardness showed the highest value around 40
of the substrate temperature and increased with the substrate bias. Adhesion was improved with the increase of substrate temperature and bias. An interlayer of pure titanium formed prior to deposition of TiN improves the adhesion at its optimum thickness. These results were explained by the change of physical morphology and phase analysis.
Effects of Coating Parameters on Transverse Rupture Strength of Cemented Carbide Coated with Titanium Carbide by CVD Process
Journal of the Korean institute of surface engineering, volume 24, issue 2, 1991, Pages 80~87
Investigations have been made in order to improve the toughness of TiC coated Cemented Carbide tools by CVD. The effects of coating parameters on TiC layer and eta phase and the effects of the thickness of TiC Coated layer and eta phase on TRS were studied.
Composition and microstructure of Pb-Sn alloy electrodeposits in pulse plating with low peak current density
Journal of the Korean institute of surface engineering, volume 24, issue 2, 1991, Pages 88~95
The tin-lead alloy was electrodeposited in the low range of peak current density in order to investigate the change of composition and microstructure of them. The Pb content of alloy deposits, which was decreased with increasing average current density, was relatively lower than that of D.C. plated alloy deposit. The preferred orientation of alloy deposit was changed with increasing peak current density and the surface morphology of alloy deposits was closely related to the preferred orientation of them.
Magnetic Properties of Electrodeposited Co-Ni-P Alloys
Journal of the Korean institute of surface engineering, volume 24, issue 2, 1991, Pages 96~102
Co-Ni-P alloys were electrodeposited from NH4Cl-sulfate-hypophosphite baths under various plating conditions. Their effective anisotropic magnetic field which is one of the important properties for magnetic recording materials were investigated as the function of alloy compositions and c-axis orientation. The preferred orientation and the contents of Ni and P depend on the pH of solutions and also on the current density. It was found that the alloy films deposited from the solutions of pH4 at high current density had c-axis orientation parallel to the growth direction and the effective anisotropic fields sufficient for perpendicular magnetic recording application.
A Study on the Electroless Ni-Cu-P Alloy Plating of Al Base Hard Disk(I)Effect on some Properties of Electroless Ni-Cu-P Deposits by Electrolyte and Heat Treatment Condition
Journal of the Korean institute of surface engineering, volume 24, issue 2, 1991, Pages 103~113
Electroless Ni-Cu-P alloy plating of Al base hard disk was performed to investigate some properties according to the change of composition. It was found that the composition of Ni and Cu in deposits changed linearly with increasing the mole ratio of NiSO4.6H2O/CuSO4.5H2O. The increase in hardness by heat - treatment was confirmed to be associated with small size grained crystallization of the amorphous deposits. Acid resistance of all deposits layer. which had been heated up to 30
, was found to be exellent when immersed in 1N-H2SO4 solution, and it showed more superior acid resistance with decreasing Cu content and with increasing P. The resistivity of the deposits heat treated became smaller at temperature more than 50
, and it became largerly with increasing P content. Cu 44.1wt% alloy(C bath) showed the most superior non-magnetically stable characteristics after heat treatment. It was superiorly with higher temperature and with decreasing P content.