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REFERENCE LINKING PLATFORM OF KOREA S&T JOURNALS
> Journal Vol & Issue
Journal of the Korean institute of surface engineering
Journal Basic Information
Journal DOI :
The Korean Institute of Surface Engineering
Editor in Chief :
Volume & Issues
Volume 25, Issue 6 - Dec 1992
Volume 25, Issue 5 - Dec 1992
Volume 25, Issue 4 - Nov 1992
Volume 25, Issue 3 - Jul 1992
Volume 25, Issue 2 - Apr 1992
Volume 25, Issue 1 - Feb 1992
Selecting the target year
Thermodynamics of Simultaneous Chromizing and Aluminizing of the Mild Steel
Journal of the Korean institute of surface engineering, volume 25, issue 4, 1992, Pages 161~164
Thermodynamic calculations were made to find an optimum condition of simultaneous chromizing and aluminizing of mild steel. Results of calculations showed that Cr-Al alloy powder should be used and the optimum composition was 90~95wt% Cr and 5~10wt% Al. Simultaneous chromizing and aluminizing of a mild steel was achieved using 95Cr-5Al wt% alloy powders as a masteralloy, NH4Cl as an activator at
K under Ar atmosphere.
Effect of Distance Between Filler Particles on the Tensile Properties
Journal of the Korean institute of surface engineering, volume 25, issue 4, 1992, Pages 165~172
Filler, popularly used in the polymer materials, was dispersed randomly and irregularly. For the study of dispersed behavior, the specimen which have two particles in polystyrene was prepared. And the tensile strength, modulus and SEM picture were measured. When the distance between particles increased, the tensile strength and modulus increased, but particle size did not affect the values. And when the am-bient temperature increased, the tensile strength and modulus decreased, but the distance did not affect the tensile strength and modulus.
Effects of Stabilizing Additives on Electroless Copper Deposition
Journal of the Korean institute of surface engineering, volume 25, issue 4, 1992, Pages 173~180
The effects of the stabilizing additives such as NaCN, 2-MBT and Thiourea on bath decom-position, plating rate and surface morphology have been studied. Bath stability was increased in the order of an additive-free bath, and NaCN-, 2-MBT-, and Thiourea-stabilized baths. The sta-bilizing effects may be attributed to the stability of Cu(II) -complexes. The plating rate is the re-verse order of the bath stability. Accelerative effect of 2-MBT in proper quantity(0.3mg/
) may be explained by visualizing it absorbed through benzene ring or sulfur atom on portions of the sub-strates. The strong bond of the complexing part of the molecule to nearby chelated copper ions would tend to accelerate plating by making it easier for the Cu2+ -ligand bond to be broken. Sur-face morphologies of copper deposits depend on the bath additives. Electroless copper deposits from the 2-MBT stabilized baths are finer than the deposits from the NaCN- and Thiourea- stabi-lized baths due to the strong adsorption on the substrates.
A study on the development of solution for the Crack Free Hard Chromium Deposits
Journal of the Korean institute of surface engineering, volume 25, issue 4, 1992, Pages 181~186
To investigate how to produce the crack free and chromium deposits, bath compositions, additives, electrolysis conditions and other electroplating parameters, such as cathodic current efficiency, surface hard-ness, crack density and corrosion rate of deposits were examined carefully. The crack free chrome deposits were well obtained using both wetting agents and two kind of additives. At 60 A/d
electrolysis condition, crack free bright hard chromium deposits were well obtained to a thickness
in Additive-I and Additive-II added solution.
Selective Contact Hole Filling by electroless Ni Plating
Journal of the Korean institute of surface engineering, volume 25, issue 4, 1992, Pages 189~206
The effect of activation and electroless nickel plating conditions on contact properties was investi-gated for selective electroless nickel plating of Si wafers in order to obtain an optimum condition of con-tact hole filling. According to RCA prosess, p-type silicon (100) surface was cleaned out and activated. The effects of temperature, DMAB concentration, time, and strirring were investigated for activation of p-type Si(100) surface. The optimal activation condition was 0.2M HF, 1mM PdCl2, 2mM EDTA,
, and 90sec under ultrasonic vibration. In electroless nickel plating, the effect of temperature, DMAB concentra-tion, pH, and plating time were studied. The optimal plating condition found was 0.10M NiSO4.H2O, 0.11M Citrate, pH 6.8,
, 30minutes. The contact resistance of films was comparatively low. It took 30minutes to obtain 1
thick film with 8mM DMAB concentration. The film surface roughness was improved with decreasing temperature and decreasing pH of the plating solution. The best quality of the film was obtained at the condition of temperature
and pH 6.0. The micro-vickers hardness of film was about 800Hv. Plating rate of nickel on the hole pattern was slower than that of nickel on the line pattern.