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REFERENCE LINKING PLATFORM OF KOREA S&T JOURNALS
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Journal of the Korean institute of surface engineering
Journal Basic Information
Journal DOI :
The Korean Institute of Surface Engineering
Editor in Chief :
Volume & Issues
Volume 28, Issue 6 - Dec 1995
Volume 28, Issue 5 - Oct 1995
Volume 28, Issue 4 - Aug 1995
Volume 28, Issue 3 - Jun 1995
Volume 28, Issue 2 - Apr 1995
Volume 28, Issue 1 - Feb 1995
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A Kinetic Study on the Electrodeposition of Ni-Zn-P Ternary Alloys onto a Steel
Journal of the Korean institute of surface engineering, volume 28, issue 4, 1995, Pages 199~206
A kinetic study on the electrodeposition of Ni-Zn-P ternary alloys onto a steel in chloride solutions was carried out using a rotating disc electrode. The coatings were characterized using SEM/EPMA and A. A. analysis. The results showed that the plating rates of three components were increased with applied potential, disc rotating speed and temperature. The activation energies of Ni, Zn and P of the coatings were 6.1, 5.1 and 8.0 kcal/mole respectively. Therefore, the deposition rates were controlled partly by surface electrochemical reaction and partly by mass transport. As the potential, temperature of bath and rotating speed of cathode disc were raised, the vol. % ratios of Ni and P of coating layer were increased but that of Zn decreased. The effect of coating parameters on the surface morphology was also examined.
A Study on the Manufacture of Composite W Powder for Low Sintering Temperature by Liquid Reduction Precipitation Method
Journal of the Korean institute of surface engineering, volume 28, issue 4, 1995, Pages 207~218
Tungsten(W) metal has excellent properties in heat-resistance, corrison-resistance and impact-resistance but W-Metal is hard to sinter because higher than
is required to sinter W-powder. Con-sequently, a deposit technique of Nikel Phosphorus(NiP) on W-powber by the liquid reduction precipitation method was performed. Sintering temperature of the resulting W-NiP composite was lowered around to
, and the mechanical properties of the sintered body was studied. The most suitable conditions for NiP thin film deposit on W-Powder by the liquid reduction precipitation method, which are composition, concentration, pH and temperature of the liquid reduction solution, were considered. The activated sintering was carried out in a reducing condition furnace. Components and properties of the sintered body were investigated by the density and the hardness measurements, X- ray diffraction analysis, and microscopic photographs of the surface. Quantity of NiP thin film on W-powder could be varied by the change of the liquid reduction solution composition. The sintering temperature of W-NiP composite powder is lowered to
and the hardness is increased (ca. 720 Hv). Large shrinkage could be observed since density was increased from 5.5 to 11.0 g/
which 86.2% of theoretical density. W metal and
crystal were detected through X-ray diffraction on the sintered body. Perfectly activated sintering was observed by microscopic photographs.
Peel Adhesion Strength and Plastic Deformation of Cu-Cr Alloy Thin Films
Journal of the Korean institute of surface engineering, volume 28, issue 4, 1995, Pages 219~224
The peel adhesion and plastic deformation in Cu-Cr alloy films, sputter-deposited onto polyimide films, have been studied as a function of Cr content in the film. The adhesion strength has been measured by T-peel test and the amount of plastic deformation in the peeled metal strip was determined qualitatively by XRD technique. Peel adhesion strength has a maximum in the film containing 22-33wt.% Cr and the peel strength of pure Cr film is lower than the maximum. The film having the highest peel strength is deformed most heavily. The effect of Cr content on the peel strength is discussed in terms of the interfacial bond strength and mechanical properties of Cu-Cr alloy film.
Effects of Pretreatment Condition and Substrate Bias on the Characteristics of MPECVD Diamond Thin Films
Journal of the Korean institute of surface engineering, volume 28, issue 4, 1995, Pages 225~235
To investigate the effects of pretreatment and substrate bias on the characteristics of the diamond thin films, the thin films were deposited on the p-type Si(100) wafer by MPECVD using mixtures of
gases. Deposition was carried out at the substrate temperature of
and at the pressure of 40torr. The effect of the pretreatment on the film formation was the examined by using SiC and diamond powders as abrasive powders. Furthermore, the substrate bias effect on the formation of the diamond film was also examined. The highest nucleation density was observed for the pretreatment with 40~60
size of diamond powders and a negative bias potential(-50V). Many defects and(111) twins in the diamond films were observed.
Electrical Treeing Phenomena at the Interface of Conductor and Insulator
Journal of the Korean institute of surface engineering, volume 28, issue 4, 1995, Pages 236~242
This paper describes a study of electrical tree growth in DGEBA/MDA/SN system subjected to ac high electric field. The dielectric breakdown process, which consists of tree initiation, tree propagation and the complete puncture of the system was investigated. Dielectric breakdown always initiated from the needle tip where the electric field reinforcement is the highest. Higher temperature and voltage accelerated the tree growth and reduced the time to breakdown.
A study on the developmenet of Anode Material for Molten Carbonate Fuel Celt - Cu-base electrode-
Journal of the Korean institute of surface engineering, volume 28, issue 4, 1995, Pages 243~254
The fabrication process of Cu-base anode for replacing Ni-base anode of molten carbonate fuel cell was investigated. Electrochemical performance and thermal stability of Cu-base anode were also investigated. Green sheet was prepared by mixing Cu and Ni powder with 1.5wt% methylcellulose and 100wt% water. The pore-size distribution of the Cu-base anode sintered at
for 30min showed almost uniform pore-size ranging from 4 to 20
and it was considered suitable for MCFC anode. Cu-Ni anode containing between 35 to 50wt% Ni exhibited current density of 111mA/
at 100mV overpotential and it was almost the some value for pure Ni anode. The sintering resistance of Cu-Ni increased with an increase of Ni addition. It was considered that the increase of sintering resistance was due to the decrease of diffusion rate of Cu and Ni with increasing the addition of Ni in Cu-Ni alloy.