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REFERENCE LINKING PLATFORM OF KOREA S&T JOURNALS
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Journal of the Korean institute of surface engineering
Journal Basic Information
Journal DOI :
The Korean Institute of Surface Engineering
Editor in Chief :
Volume & Issues
Volume 32, Issue 6 - Dec 1999
Volume 32, Issue 4 - Aug 1999
Volume 32, Issue 3 - Jun 1999
Volume 32, Issue 2 - Apr 1999
Volume 32, Issue 1 - Feb 1999
Selecting the target year
Electroless Ni Plating on Pb-base Ceramics
Journal of the Korean institute of surface engineering, volume 32, issue 4, 1999, Pages 487~495
In order to form metallic electrodes on PZT (Pb (Zr, Ti)O
) ceramics, plating conditions for optimal electroless Ni deposition were investigated. Pb in PZT is the major component to inhibit the electroless deposition, because it plays a active role of catalytic poison in plating solution. Adhesion of the electroless Ni deposits is measured by push-pull scale test and peel test. Results such as deposition ability, deposition rate, and thickness of deposits showed in terms of concentration of etchant, composition of catalyzing solution, and composition and pH of electroless bath solution.
A study on the adhesion of Ag film deposited on Alloy42 substrate
Journal of the Korean institute of surface engineering, volume 32, issue 4, 1999, Pages 496~502
Electroplating of Ag and Au on the functional area of lead frames are required for good bonding ability in IC packaging. As the patterns of the lead frame become finer, development of new deposition technology has been required for solving problems associated with process control for uniform thickness on selected area. Sputtering was employed to investigate the adhesion between substrate Alloy42 and Ag film as a new candidate process alternative to conventional electroplating. Coating thickness of Ag film was controlled to 3.5
at room temperature as a reference. The deposition of film was optimized to ensure the adhesion by process parameters of substrate heating temperature at
, sputter etching time at -300V for 10~30min, bias voltage of -100~-500V, and existence of Cr interlayer film of
. The critical
/, defined as the minimum load at which initial damage occurs, was the highest up to 29N at bias voltage of -500V by scratch test. AFM surface image and AES depth profile were investigated to analyze the interface. The effect of bias voltage in sputtering was to improve the surface roughness and remove the oxide on Alloy42.
The TEM Characterization of the Interfacial Microstructure between In Solder and Au/Ni/Ti Thin Films during Reflow Process
Journal of the Korean institute of surface engineering, volume 32, issue 4, 1999, Pages 503~512
The crystal structure and the microstructure of the intermetallic compounds formed in the interface between In solder and Au/Ni/Ti thin films have been investigated by XRD, SEM, and TEM. Indium solder was deposited on the Au/Ni/Ti thin films/Si substrate by evaporation. The heat treatments simulated the flip chip solder joining were performed in RTA system or in furnace.
phase is formed in all specimens.
phase are formed in the interface between
and Ni depending the heat treatment conditions.
A study on the effects of variously configured magnets on the characteristics of inductively coupled plasma
Journal of the Korean institute of surface engineering, volume 32, issue 4, 1999, Pages 513~520
In this study, we investigated the effects of variously configured magnets on the characteristics of the plasmas to enhance plasma uniformity and density of an inductively coupled plasma source. As the magnets, Helmholtz type axial electromagnets and various multi-dipole magnets types around the chamber wall were used. To characterize the plasma as a function of the combination of the magnets and magnetic field strengths, ion density, electron temperature, and plasma potential were measured using an electrostatic probe along the chamber diameter for Ar plasmas. The measured maximum ion densities were $8
with 600W inductive power and at 5mTorr of operational pressure and the uniformity of ion density was less than 5.9% at 2mTorr of operational pressure. The combination of an optimized multi-dipole magnet type and an axial electromagnet showed the lowest electron temperature (3eV) and plasma potential (
Corrosion resistance and Hardness of Tin-Nickel Electrodeposits
Journal of the Korean institute of surface engineering, volume 32, issue 4, 1999, Pages 521~530
The corrosion resistance and the hardness of the tin-nickel alloy deposits electroplated in pyrophosphate bath were invesitigated according to electrolysis conditions and microstructure of the alloy. The weight loss of alloy deposits increased with the Sn content of single phase (Ni-Sn) alloy showing the lowest weight loss in the alloy with 54∼57wt% Sn. On the other hand, the multiphase alloy with 35∼42wt% Sn showed the highest one. The CASS test result was consistent with that of immersion test, and was good agreement with the corrosion data of polarization measurements. The hardness of alloy deposits decreased with the increase of Sn ratio in bath due to the grain size increase of the alloy. However, it increased noticeably with decreasing current density in the bath condition of low Sn ratio (0.1)
Effect of Brown Oxide Formation on the Fracture Toughness of Leadframe/EMC Interface
H. Y., Lee ; J., Yu ;
Journal of the Korean institute of surface engineering, volume 32, issue 4, 1999, Pages 531~537
A copper based leadframe was oxidized in brown-oxide forming solution, then the growth characteristics of brown oxide and the effect of brown-oxide formation on the adhesion strength of leadframe to epoxy molding compound (EMC) were studied by using sandwiched double cantilever beam (SDCB) specimens. The brown oxide is composed of fine acicular CuO, and its thickness increased up to ~150 nm within 2 minutes and saturated. Bare leadframe showed alomost no adhesion to EMC, while once the brown-oxide layer formed on the Surface of leadframe, the adhesion strength increased up to ~80 J/
within 2 minutes. Correlation between oxide thickness,
and the adhesion strength in terms of interfacial fracture toughness,
was linear. Considering the above results, we might conclude that the main adhesion mechanism of brown-oxide treated leadframe to EMC is mechanical interlocking, in which fine acicular CuO plays a major role.e.
Photoelectrochemical Property of Ti(IV)-Fe(III) Oxide Films Deposited by MOCVD
Journal of the Korean institute of surface engineering, volume 32, issue 4, 1999, Pages 538~546
Ti(IV)-Fe(III) oxide films were formed by MOCVD technique, and their photoelectrochemical properties were examined in 0.5M N
solution by a photoelectrochemical polarization test. Ti(IV)-Fe(III) oxide films deposited at 40
by MOCVD have crystalline structure and are all n-type semiconductors. The photocurrent and the quantum efficiency of the films increase with increasing the iron cationic fraction (
) in the films. The energy band gap of the films increase linearly with increasing the iron cationic fraction in the films. Ti(IV)-Fe(III) oxide film of
/=0.60 has high photocurrent response and corrosion resistance simultaneously.
Interfacial Reaction of Galvanized Steel in Ni Added Zn-0.18Al Bath
Journal of the Korean institute of surface engineering, volume 32, issue 4, 1999, Pages 547~554
The interfacial reaction, spangle and coating thickness of galvanized steel in Ni added Zn-0.18Al bath have been investigated. The size of spangle and thickness of reaction layer were observed under an optical microscope, SEM and EDS. Analysing the experimental results concerning spangle size of galvanized steel it was found that Ni addition in Zn-0.18Al bath tended to be minimized spangle size. For Zn-0.18Al bath, addition of 0.1Ni suppressed the formation of Fe-Zn intermetallic compounds but increased with Ni content above 0.1%. The coating thickness of galvanized steel was reduced with Ni addition in Zn-0.18Al bath, especially in Zn-0.18Al-0.05Ni bath. Addition of Al in Ni containing bath resulted in forming the Al-Ni intermetallic compounds such as
Ni which consist most of top precipitates.
Edge overcoating and buildup of continuously hot-dip metallized strip
Journal of the Korean institute of surface engineering, volume 32, issue 4, 1999, Pages 555~560
Gas wiping of continuously hot-dip galvanized coating on steel strip has generated edge overcoating and noise problems. The overcoating of zinc in the edge zone from edge to 50mm inside of the strip along its width was measured and analyzed. The overcoating is thought to occur due to the reduced impinging pressure of wiping gas onto the strip edges by the boundary effect and it can decrease by 50% or more by applying edge baffles when the baffle-to-strip distance is maintained to 20mm or less. The overcoating was compared with edgedrop of the cold-rolled steel substrate. Edge buildup mostly at the edge area 10 to be 20mm from the edge results in if the edgedrop is not sufficient enough to compensate for the overcoating to be flat on the edgedrop or/and if the overcoating is not small enough to the given edgedrop. Edge baffles can reduce effectively this type of edge buildup.