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REFERENCE LINKING PLATFORM OF KOREA S&T JOURNALS
> Journal Vol & Issue
Transactions of Materials Processing
Journal Basic Information
Journal DOI :
The Korean Society for Technology of Plasticity
Editor in Chief :
Volume & Issues
Volume 11, Issue 8 - Dec 2002
Volume 11, Issue 7 - Nov 2002
Volume 11, Issue 6 - Oct 2002
Volume 11, Issue 5 - Sep 2002
Volume 11, Issue 4 - Aug 2002
Volume 11, Issue 3 - Apr 2002
Volume 11, Issue 2 - Apr 2002
Volume 11, Issue 1 - Feb 2002
Selecting the target year
Development of Micro Tensile Tester for High Functional Materials
Transactions of Materials Processing, volume 11, issue 7, 2002, Pages 561~568
DOI : 10.5228/KSPP.2002.11.7.561
Micro tensile test is the most direct and convenient method to measure material properties such as Young's modulus and fracture strength. It, however, needs more accurate measurement system, mote stable and repetitive alignment and more sensitive gripping than conventional tensile test. Many researchers have put their effort on overcoming these difficulties for tile development of micro tensile tester, fabricating micro specimens of functional materials and measuring their properties. This paper will review the related vigorous researches over the world in the recent decade and explain how to apply them to a design of the fester which is under our own development.
Fabrication and Characterizations of Thick PZT Films for Micro Piezoelectric Devices
Transactions of Materials Processing, volume 11, issue 7, 2002, Pages 569~574
DOI : 10.5228/KSPP.2002.11.7.569
Recently, thick PZT films are required for the cases of micro piezoelectric devices with high driving force, high breakdown voltage and high sensitivity, and so on. In this work, thick PZT films were fabricated by Sol-Gel multi-coating method. Microstructures, and electrical properties of films were investigated by XRD, FESEM, impedance analyzer, and P-E hysteresis. PZT films with 2.7
thickness were fabricated. Dielectric constant, loss, remnant polarization and coercive field of them were 880~1650 at 1kHz, 2~3% at 1kHz, 26~32
, and 33~60kV/cm, respectively. Also a transverse piezoelectric coefficient
measurement system was fabricated and tested for thick film samples.
Assessment of Elastic and Microfailure Properties of MEMS Materials Using Electrostatically Operated Test Device
Transactions of Materials Processing, volume 11, issue 7, 2002, Pages 575~580
DOI : 10.5228/KSPP.2002.11.7.575
To evaluate elastic and micro-failure properties of MEMS materials, the electro-statically operated test devices were designed and fabricated by micro machining technology. The test structures consist or comb drives for loading and suspending beams in testing. From the analysis of beam displacement based on elastic beam theory, elastic modulus and yield strength of Al film were measured. And, by introducing the micro notch and cyclic loading, the micro-failure was Induced and the micro-fracture toughness of Si film was evaluated. Moreover, the cycles to failure were estimated from the degradation of resonant frequency. Finally, the effects of notch on micro failure were discussed.
Finite Element Analysis for Shape Prediction on Micro Lens Forming
Transactions of Materials Processing, volume 11, issue 7, 2002, Pages 581~588
DOI : 10.5228/KSPP.2002.11.7.581
Among the processes to produce micro lens, the process using press molding is a new technology to simplify the process, but it contains many unknown variables. The press-molding process proposed in this paper was simplified into two step process, the first step is the pressing to design the preform for glass element, the second step is the annealing to reduce the residual stress. It is important to estimate the amount of shrinkage of glass gob and the residual stress during process. It Is difficult to evaluate the process variables as mentioned above through the experiment. The influences due to process variables was evaluated by using FEM parametric analysis. The results in this paper can be applicable to produce micro lens.
Design and Evaluation of Automatic Joining-Assembly System of Optical Collimators with High Functionality
Transactions of Materials Processing, volume 11, issue 7, 2002, Pages 589~595
DOI : 10.5228/KSPP.2002.11.7.589
Up to now, Collimators have been generally produced by handwork and only a few companies have produced by semi-automatic system. Under this situation, automatic system for assembly of optical collimator has risen as a most essential technique in the development of optical communication components. In this study, it was constructed to develop optical collimators with high functionality and We manufactured optical collimators with a GRIN rod lens using automatic system. Therefore, we worked a performance test through a comparison of collimators made by automatic system and handwork with angle alignment, beam size. Also we compared common product with auto-manufactured sample. As a result, it brought a reduction of the tact time and an improvement of an efficiency and a productivity of optical collimators. therefore it was found that automatic system was indispensable for materialization of optical collimators with high functionality.
Development of Ultrasonic Bonding Process for Micro Components
Transactions of Materials Processing, volume 11, issue 7, 2002, Pages 596~600
DOI : 10.5228/KSPP.2002.11.7.596
The ultrasonic bonding method and its feasibility are investigated in this work for joining the micro components and MEMS packaging. The ultrasonic bonding process is analyzed using a lumped mode, and preliminary experiments using the eutectic solder and copper pin were carried out to verify possibility to MEMS packaging. The ultrasonic bonding process appears to be adequate for MEMS packaging by providing localized heating at the selected area. Microscopic behavior of the bond joint through ultrasonic vibration needs further investigation.
Micromachining of Fused Silica by KrF Excimer Laser Induced Wet Etching
Transactions of Materials Processing, volume 11, issue 7, 2002, Pages 601~607
DOI : 10.5228/KSPP.2002.11.7.601
Optically transparent materials such as fused silica, quartz and crystal have become important in the filed of optics and optoelectronics. Laser ablation continues to grow as an important technique for micromachining and surface modification of various materials, because many problems caused by direct contact between tools and workpiece can be avoided. Especially, laser ablation with excimer lasers enables fine micromachining of transparent materials such as fused silica, quartz and crystal, etc. In this study, laser-induced wet etching of fused silica in organic solution was conducted. KrF excimer laser was used as a light source and acetone solution of pyrene was used as etchant. Changing the number of laser pulses, micro holes of various depths are fabricated.
Characteristics of High-Aspect-Ratio Ultrasonic Machining of Glass
Transactions of Materials Processing, volume 11, issue 7, 2002, Pages 608~613
DOI : 10.5228/KSPP.2002.11.7.608
An ultrasonic machining process is efficient and economical means for precision machining of glass and ceramic materials. However, the mechanism of the process with respect to the crack initiation and propagation and the stress development in the ceramic workpiece subsurface arc still not well understood. In this research, we have investigated the basic mechanism of ultrasonic machining of ultrasonic machining of glass by the experimental approach. For this purpose, we designed and fabricated the desktop micro ultrasonic machine. The feed is controlled precisely by using the constant load control system. During machining experiments, the effects of abrasive characteristics and machining conditions on the surface roughness and the material removal rate are measured and compared.
An Experimental Technique with Pattern Recognition for Deformation Measurement of Small Structures
Transactions of Materials Processing, volume 11, issue 7, 2002, Pages 614~619
DOI : 10.5228/KSPP.2002.11.7.614
For an accurate measurement of the material behavior of small structures, a new optical experimental technique is proposed to measure the deformation. The test method uses the dual microscope that can measure the relative deformation of two adjacent regions. The magnified view is captured by CCD cameras and the relative deformation can be measured by the pattern matching and tracing method. Using this experimental technique, the deformation of solder joints in electronic packaging and the strain of the nickel thin film are measured.
Development of System based on Digital Image Processing for Precision Measurement of Micro Spring
Transactions of Materials Processing, volume 11, issue 7, 2002, Pages 620~627
DOI : 10.5228/KSPP.2002.11.7.620
The purpose of this paper is the development of an automated measurement system for micro spring based on the digital image processing technique. This micro spring can be used in various engineering applications such as filament, load bearing springs, hard disk suspension and many others. Main functionality of the micro spring inspection system is to measure the representative pitch of the micro spring. The derivative operators are used for edge detection in gray level image. Measurement system developed in this paper consisted of new auto feeding mechanism to take advantage of air pressure. In the process of development of the micro spring inspection system based on the image processing and analysis, strong background technology and know-how have been accumulated to measure micro mechanical parts.